OTP ROM, 4KX8, 35ns, CMOS, CDIP24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
Maximum access time | 35 ns |
I/O type | COMMON |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
memory density | 32768 bit |
memory width | 8 |
Number of terminals | 24 |
word count | 4096 words |
character code | 4000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
ETC2732Q-35 | ETC2732Q-55 | ETC2732Q-45E | ETC2732Q-45D | ETC2732Q-35D | ETC2732Q-55E | ETC2732Q-35V | ETC2732Q-55V | ETC2732Q-45V | |
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Description | OTP ROM, 4KX8, 35ns, CMOS, CDIP24 | OTP ROM, 4KX8, 55ns, CMOS, CDIP24 | OTP ROM, 4KX8, 45ns, CMOS, CDIP24 | OTP ROM, 4KX8, 45ns, CMOS, CDIP24 | OTP ROM, 4KX8, 35ns, CMOS, CDIP24 | OTP ROM, 4KX8, 55ns, CMOS, CDIP24 | OTP ROM, 4KX8, 35ns, CMOS, CDIP24 | OTP ROM, 4KX8, 55ns, CMOS, CDIP24 | OTP ROM, 4KX8, 45ns, CMOS, CDIP24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 35 ns | 55 ns | 45 ns | 45 ns | 35 ns | 55 ns | 35 ns | 55 ns | 45 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
word count | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
character code | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | - | -25 °C | -20 °C | -20 °C | -25 °C | -40 °C | -40 °C | -40 °C |
organize | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL | COMMERCIAL | OTHER | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |