UVPROM, 128KX8, 300ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
Parameter Name | Attribute value |
package instruction | DIP, |
Reach Compliance Code | unknown |
Maximum access time | 300 ns |
JESD-30 code | R-GDIP-T32 |
length | 42.1005 mm |
memory density | 1048576 bit |
Memory IC Type | UVPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX8 |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Maximum seat height | 5.588 mm |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
Base Number Matches | 1 |