256K X 8 OTP CMOS EPROM
A27020 | A27020-70 | A27020L-55 | A27020L-70 | |
---|---|---|---|---|
Description | 256K X 8 OTP CMOS EPROM | 256K X 8 OTP CMOS EPROM | 256K X 8 OTP CMOS EPROM | 256K X 8 OTP CMOS EPROM |
Is it Rohs certified? | - | incompatible | incompatible | incompatible |
Maker | - | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] |
package instruction | - | DIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | - | unknow | unknow | unknow |
Maximum access time | - | 70 ns | 55 ns | 70 ns |
I/O type | - | COMMON | COMMON | COMMON |
JESD-30 code | - | R-PDIP-T32 | R-PQCC-J32 | R-PQCC-J32 |
memory density | - | 2097152 bi | 2097152 bi | 2097152 bi |
memory width | - | 8 | 8 | 8 |
Number of terminals | - | 32 | 32 | 32 |
word count | - | 262144 words | 262144 words | 262144 words |
character code | - | 256000 | 256000 | 256000 |
Maximum operating temperature | - | 70 °C | 70 °C | 70 °C |
organize | - | 256KX8 | 256KX8 | 256KX8 |
Output characteristics | - | 3-STATE | 3-STATE | 3-STATE |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | DIP | QCCJ | QCCJ |
Encapsulate equivalent code | - | DIP32,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | IN-LINE | CHIP CARRIER | CHIP CARRIER |
power supply | - | 5 V | 5 V | 5 V |
Certification status | - | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | - | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | - | 0.03 mA | 0.03 mA | 0.03 mA |
Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V |
surface mount | - | NO | YES | YES |
technology | - | CMOS | CMOS | CMOS |
Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | - | THROUGH-HOLE | J BEND | J BEND |
Terminal pitch | - | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | - | DUAL | QUAD | QUAD |