ACS11KMSR-03 datasheet, PDF - EEWORLD Datasheet

ACS11KMSR-03: DescriptionAC SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, CERAMIC, DFP-14; Categorylogic logic; File Size52KB，2 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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ACS11KMSR-03 Overview

AC SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, CERAMIC, DFP-14

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
Parts packaging code	DFP
package instruction	DFP,
Contacts	14
Reach Compliance Code	unknown
series	AC
JESD-30 code	R-CDFP-F14
Logic integrated circuit type	AND GATE
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
propagation delay (tpd)	12 ns
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
Maximum seat height	2.92 mm
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
total dose	300k Rad(Si) V
width	6.285 mm
Base Number Matches	1

	ACS11KMSR-03	ACS11HMSR-03	ACS11K/SAMPLE-03	ACS11D/SAMPLE-03
Description	AC SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, CERAMIC, DFP-14	AC SERIES, TRIPLE 3-INPUT AND GATE, UUC16, DIE-16	AC SERIES, TRIPLE 3-INPUT AND GATE, CDFP14	AC SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, SIDE BRAZED, CERAMIC, DIP-14
Parts packaging code	DFP	DIE	DFP	DIP
package instruction	DFP,	DIE,	DFP,	DIP,
Contacts	14	16	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown
series	AC	AC	AC	AC
JESD-30 code	R-CDFP-F14	R-XUUC-N16	R-CDFP-F14	R-CDIP-T14
Logic integrated circuit type	AND GATE	AND GATE	AND GATE	AND GATE
Number of functions	3	3	3	3
Number of entries	3	3	3	3
Number of terminals	14	16	14	14
Package body material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP	DIE	DFP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	UNCASED CHIP	FLATPACK	IN-LINE
propagation delay (tpd)	12 ns	12 ns	12 ns	12 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Terminal form	FLAT	NO LEAD	FLAT	THROUGH-HOLE
Terminal location	DUAL	UPPER	DUAL	DUAL
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation
Maximum seat height	2.92 mm	-	2.92 mm	5.08 mm
Terminal pitch	1.27 mm	-	1.27 mm	2.54 mm
width	6.285 mm	-	6.285 mm	7.62 mm

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