ACS11HMSR-03 datasheet, PDF - EEWORLD Datasheet

ACS11HMSR-03: DescriptionAC SERIES, TRIPLE 3-INPUT AND GATE, UUC16, DIE-16; Categorylogic logic; File Size52KB，2 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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ACS11HMSR-03 Overview

AC SERIES, TRIPLE 3-INPUT AND GATE, UUC16, DIE-16

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Contacts	16
Reach Compliance Code	unknown
series	AC
JESD-30 code	R-XUUC-N16
Logic integrated circuit type	AND GATE
Number of functions	3
Number of entries	3
Number of terminals	16
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
propagation delay (tpd)	12 ns
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	UPPER
total dose	300k Rad(Si) V
Base Number Matches	1

	ACS11HMSR-03	ACS11KMSR-03	ACS11K/SAMPLE-03	ACS11D/SAMPLE-03
Description	AC SERIES, TRIPLE 3-INPUT AND GATE, UUC16, DIE-16	AC SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, CERAMIC, DFP-14	AC SERIES, TRIPLE 3-INPUT AND GATE, CDFP14	AC SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, SIDE BRAZED, CERAMIC, DIP-14
Parts packaging code	DIE	DFP	DFP	DIP
package instruction	DIE,	DFP,	DFP,	DIP,
Contacts	16	14	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown
series	AC	AC	AC	AC
JESD-30 code	R-XUUC-N16	R-CDFP-F14	R-CDFP-F14	R-CDIP-T14
Logic integrated circuit type	AND GATE	AND GATE	AND GATE	AND GATE
Number of functions	3	3	3	3
Number of entries	3	3	3	3
Number of terminals	16	14	14	14
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIE	DFP	DFP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	FLATPACK	FLATPACK	IN-LINE
propagation delay (tpd)	12 ns	12 ns	12 ns	12 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Terminal form	NO LEAD	FLAT	FLAT	THROUGH-HOLE
Terminal location	UPPER	DUAL	DUAL	DUAL
Maker	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Maximum seat height	-	2.92 mm	2.92 mm	5.08 mm
Terminal pitch	-	1.27 mm	1.27 mm	2.54 mm
width	-	6.285 mm	6.285 mm	7.62 mm

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