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XC95180-10PQ160C

Description
Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160
CategoryProgrammable logic devices    Programmable logic   
File Size147KB,5 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Download Datasheet Parametric Compare View All

XC95180-10PQ160C Overview

Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160

XC95180-10PQ160C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerXILINX
Parts packaging codeQFP
package instructionQFP,
Contacts160
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-30 codeS-PQFP-G160
JESD-609 codee0
length28 mm
Humidity sensitivity level3
Dedicated input times
Number of I/O lines133
Number of terminals160
Maximum operating temperature70 °C
Minimum operating temperature
organize0 DEDICATED INPUTS, 133 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)225
Programmable logic typeFLASH PLD
propagation delay10 ns
Certification statusNot Qualified
Maximum seat height4.1 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width28 mm
Base Number Matches1

XC95180-10PQ160C Related Products

XC95180-10PQ160C XC95180-10HQG208C XC95180-10PQG160C XC95180-10HQ208C
Description Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160 Flash PLD, 10ns, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160 Flash PLD, 10ns, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208
Is it Rohs certified? incompatible conform to conform to incompatible
Maker XILINX XILINX XILINX XILINX
Parts packaging code QFP QFP QFP QFP
package instruction QFP, HFQFP, QFP, HFQFP,
Contacts 160 208 160 208
Reach Compliance Code compliant compliant compliant compliant
JESD-30 code S-PQFP-G160 S-PQFP-G208 S-PQFP-G160 S-PQFP-G208
JESD-609 code e0 e3 e3 e0
length 28 mm 28 mm 28 mm 28 mm
Humidity sensitivity level 3 3 3 3
Number of I/O lines 133 166 133 166
Number of terminals 160 208 160 208
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 0 DEDICATED INPUTS, 133 I/O 0 DEDICATED INPUTS, 166 I/O 0 DEDICATED INPUTS, 133 I/O 0 DEDICATED INPUTS, 166 I/O
Output function MACROCELL MACROCELL MACROCELL MACROCELL
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP HFQFP QFP HFQFP
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius) 225 245 245 225
Programmable logic type FLASH PLD FLASH PLD FLASH PLD FLASH PLD
propagation delay 10 ns 10 ns 10 ns 10 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.1 mm 4.1 mm 4.1 mm 4.1 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD MATTE TIN MATTE TIN TIN LEAD
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.5 mm 0.65 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 40 40 30
width 28 mm 28 mm 28 mm 28 mm
Base Number Matches 1 1 1 1

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