Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | XILINX |
Parts packaging code | QFP |
package instruction | QFP, |
Contacts | 160 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
JESD-30 code | S-PQFP-G160 |
JESD-609 code | e0 |
length | 28 mm |
Humidity sensitivity level | 3 |
Dedicated input times | |
Number of I/O lines | 133 |
Number of terminals | 160 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 0 DEDICATED INPUTS, 133 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 225 |
Programmable logic type | FLASH PLD |
propagation delay | 10 ns |
Certification status | Not Qualified |
Maximum seat height | 4.1 mm |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 28 mm |
Base Number Matches | 1 |
XC95180-10PQ160C | XC95180-10HQG208C | XC95180-10PQG160C | XC95180-10HQ208C | |
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Description | Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160 | Flash PLD, 10ns, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 | Flash PLD, 10ns, CMOS, PQFP160, PLASTIC, QFP-160 | Flash PLD, 10ns, CMOS, PQFP208, HEAT SINK, PLASTIC, QFP-208 |
Is it Rohs certified? | incompatible | conform to | conform to | incompatible |
Maker | XILINX | XILINX | XILINX | XILINX |
Parts packaging code | QFP | QFP | QFP | QFP |
package instruction | QFP, | HFQFP, | QFP, | HFQFP, |
Contacts | 160 | 208 | 160 | 208 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
JESD-30 code | S-PQFP-G160 | S-PQFP-G208 | S-PQFP-G160 | S-PQFP-G208 |
JESD-609 code | e0 | e3 | e3 | e0 |
length | 28 mm | 28 mm | 28 mm | 28 mm |
Humidity sensitivity level | 3 | 3 | 3 | 3 |
Number of I/O lines | 133 | 166 | 133 | 166 |
Number of terminals | 160 | 208 | 160 | 208 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 0 DEDICATED INPUTS, 133 I/O | 0 DEDICATED INPUTS, 166 I/O | 0 DEDICATED INPUTS, 133 I/O | 0 DEDICATED INPUTS, 166 I/O |
Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | HFQFP | QFP | HFQFP |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK | FLATPACK, HEAT SINK/SLUG, FINE PITCH |
Peak Reflow Temperature (Celsius) | 225 | 245 | 245 | 225 |
Programmable logic type | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
propagation delay | 10 ns | 10 ns | 10 ns | 10 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.1 mm | 4.1 mm | 4.1 mm | 4.1 mm |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | MATTE TIN | MATTE TIN | TIN LEAD |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | 30 | 40 | 40 | 30 |
width | 28 mm | 28 mm | 28 mm | 28 mm |
Base Number Matches | 1 | 1 | 1 | 1 |