MF28F008-10 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> MF28F008-10

MF28F008-10: DescriptionFlash, 1MX8, 100ns, CDFP42, CERAMIC, FP-42; Categorystorage storage; File Size399KB，28 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

Download Datasheet Parametric Compare View All

MF28F008-10 Overview

Flash, 1MX8, 100ns, CDFP42, CERAMIC, FP-42

MF28F008-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DFP
package instruction	DFP, FL42,.6
Contacts	42
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	100 ns
command user interface	YES
Data polling	NO
JESD-30 code	R-CDFP-F42
JESD-609 code	e0
length	26.925 mm
memory density	8388608 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	16
Number of terminals	42
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1MX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL42,.6
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	2.17 mm
Department size	64K
Maximum standby current	0.0001 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	16.256 mm
Base Number Matches	1

MF28F008-10 Related Products

	MF28F008-10	MC28F008-10	MC28F008-12	MF28F008-12
Description	Flash, 1MX8, 100ns, CDFP42, CERAMIC, FP-42	Flash, 1MX8, 100ns, CDIP40, SIDE BRAZED, CERAMIC, DIP-40	Flash, 1MX8, 120ns, CDIP40, SIDE BRAZED, CERAMIC, DIP-40	Flash, 1MX8, 120ns, CDFP42, CERAMIC, FP-42
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DFP	DIP	DIP	DFP
package instruction	DFP, FL42,.6	WDIP, DIP40,.6	SIDE BRAZED, CERAMIC, DIP-40	DFP, FL42,.6
Contacts	42	40	40	42
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	100 ns	100 ns	120 ns	120 ns
command user interface	YES	YES	YES	YES
Data polling	NO	NO	NO	NO
JESD-30 code	R-CDFP-F42	R-CDIP-T40	R-CDIP-T40	R-CDFP-F42
JESD-609 code	e0	e0	e0	e0
length	26.925 mm	50.8 mm	50.8 mm	26.925 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of departments/size	16	16	16	16
Number of terminals	42	40	40	42
word count	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	1MX8	1MX8	1MX8	1MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP	WDIP	WDIP	DFP
Encapsulate equivalent code	FL42,.6	DIP40,.6	DIP40,.6	FL42,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE, WINDOW	IN-LINE, WINDOW	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Programming voltage	12 V	12 V	12 V	12 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES
Maximum seat height	2.17 mm	5.51 mm	5.51 mm	2.17 mm
Department size	64K	64K	64K	64K
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
switch bit	NO	NO	NO	NO
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	16.256 mm	15.24 mm	15.24 mm	16.256 mm
Maker	-	Intel	Intel	Intel
reverse pinout	-	YES	YES	YES
Filter level	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B

Recommended Resources

Towel machine fault detection circuit

Measuring circuit with sinusoidal output voltage

Sensor circuit diagram of pressure transducer

Automatic spray controller circuit

Display music doorbell

555 light-controlled automatic timing energy-saving street light

【EasyARM-RT1052 Review】 + cJSON transplantation and use: [i=s]This post was last edited by ID.LODA on 2018-12-21 09:19[/i] [font=微软雅黑][size=4] [color=#333333]The use of JSON strings in IoT devices is also quite common nowadays. Let’s share and learn about i...; ID.LODA NXP MCU

Construction of the Crazy Shell AI open source drone development environment: 1. Installation of MDK MDK, the ARM development tool developed by Keil, is used to develop embedded applications for a series of microcontrollers based on the ARM core . It is suitable for developers ...; fengke MCU

Raspberry Pi Windows IoT Development (V) SPI Interface: Table of contentsRaspberry Pi Windows IoT Development (Part 1) Raspberry Pi Windows IoT Development (Part 2) USB Camera Raspberry Pi Windows IoT Development (Part 3) Flashing LED Raspberry Pi Windows ...; bigbat WindowsCE

Thanks to the administrators, the invitation-related functions have indeed been greatly improved.: Thanks to the administrators, the invitation-related functions have indeed been greatly improved, as shown in the following figure, which is very good.Thank you, but I remember that a few days before ...; 深圳小花 Suggestions & Announcements

Causes and solutions for poor wetting in PCBA processing: In pcba processing, when the surface tension of solder is destroyed, it will cause poor soldering of surface mount components. The main manifestation of poor wetting is that during the soldering proce...; ohahaha PCB Design

Introduce DSP data structure program optimization method: Choosing the right data structure is important. If you use a lot of insert and delete instructions on a bunch of randomly stored numbers, it will be much faster to use a linked list. Arrays and pointe...; Jacktang Microcontroller MCU

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components