Synchronous DRAM Module, 4MX64, 6ns, CMOS, PDMA168
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | not_compliant |
Maximum access time | 6 ns |
Maximum clock frequency (fCLK) | 125 MHz |
I/O type | COMMON |
JESD-30 code | R-PDMA-N168 |
memory density | 268435456 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 64 |
Number of terminals | 168 |
word count | 4194304 words |
character code | 4000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX64 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM168 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
Maximum seat height | 29.21 mm |
Maximum standby current | 0.048 A |
Maximum slew rate | 1.2 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
MT16LSDT464AG-10A | MT16LSDT464AG-663 | |
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Description | Synchronous DRAM Module, 4MX64, 6ns, CMOS, PDMA168 | Synchronous DRAM Module, 4MX64, 9ns, CMOS, PDMA168 |
Is it Rohs certified? | incompatible | incompatible |
Reach Compliance Code | not_compliant | not_compliant |
Maximum access time | 6 ns | 9 ns |
Maximum clock frequency (fCLK) | 125 MHz | 83 MHz |
I/O type | COMMON | COMMON |
JESD-30 code | R-PDMA-N168 | R-PDMA-N168 |
memory density | 268435456 bit | 268435456 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 64 | 64 |
Number of terminals | 168 | 168 |
word count | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 |
Maximum operating temperature | 70 °C | 70 °C |
organize | 4MX64 | 4MX64 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIMM | DIMM |
Encapsulate equivalent code | DIMM168 | DIMM168 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified |
refresh cycle | 4096 | 4096 |
Maximum seat height | 29.21 mm | 29.21 mm |
Maximum standby current | 0.048 A | 0.032 A |
Maximum slew rate | 1.2 mA | 1 mA |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
Base Number Matches | 1 | 1 |