Features
•
Can be used as either 1 off 512k x 32, 2 off 512k x 16 or 4 off 512k x 8
•
Operating Voltage: 3.3V
•
Access Time:
•
•
•
•
•
•
•
•
•
•
•
– 15 ns for 3.3V biased only (AT68166F)
– 25 ns & 17 ns for 5V Tolerant (AT68166FT)
Very Low Power Consumption
– Active: 650 mW per byte (Max) @ 15 ns - 540 mW per byte (Max) @ 25ns
– Standby: 15 mW (Typ)
Wide Temperature Range: -55 to +125°C
TTL-Compatible Inputs and Outputs
Asynchronous
Die manufactured on Atmel 0.25 µm Radiation Hardened Process
No Single Event Latch Up below LET Threshold of 80 MeV/mg/cm
2
Tested up to a Total Dose of 300 krads (Si) according to MIL-STD-883 Method 1019
950 Mils Wide MQFPT 68 Package
ESD Better than 4000V for the AT68166F
ESD Better than 2000V for the AT68166FT
Quality Grades: ESCC, QML-Q or V
Rad Hard
16 MegaBit
SRAM Multi
Chip Module
AT68166F
AT68166FT
Advanced
Information
Description
The AT68166F/FT is a Radiation Hardened hermetic Multi Chip Modules (MCM), inte-
grating very low-power CMOS asynchronous static RAM which can be organized as 1
bank off 512K x 32, 2 banks off 512Kx16, or 4 banks off 512Kx8. It is built with 4 dies
of the AT60142F/FT SRAM keeping all their basic characteristics: power consump-
tion, stand by current, data retention, Multiple Bit Upset (MBU) immune, etc…
This MCM takes full benefit of Atmel expertise in hermetic ceramic package assembly.
The small size of the AT60142F/FT die allows for assembling it in a 68 pins quad flat
pack which results into a package footprint compatible with products from other
sources. Furthermore, all die being assembled on the same package side makes
power dissipation through the PCB much easier and more efficient.
This MCM brings the solution to applications where fast computing is as mandatory as
low power consumption and higher integration density, saving 75% of the PCB area
used when using the individually package 4MB SRAM.
The F version is biased at 3.3V and is not 5V tolerant. It is available in 15 ns
specification.
The FT version is a variant allowing for 5V tolerance. It is available in 25 ns and 17 ns
specification.
The AT68166F/FT will be processed according to the test methods of the latest revi-
sion of the MIL PRF-38535 or the ESCC 9000.
7531B–AERO–02/06
AT68166F/FT
Electrical Characteristics
Absolute Maximum Ratings*
Supply Voltage to GND Potential:.........................-0.5V + 4.6V
DC Input Voltage:.....................................GND -0.5V to 4.6V
(1)
DC Output Voltage High Z State: ................GND -0.5V to 4.6V
Storage Temperature: ................................... -65°C to + 150°C
Output Current Into Outputs (Low): ............................... 20 mA
Electro Statics Discharge Voltage
(2)
:.. .........> 4000V (MIL STD
883D Method 3015.3)
Note:
1. 7V for FT version.
2. For AT68166F. It is better than 2000V for AT68166FT.
*NOTE:
Stresses beyond those listed under "Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional oper-
ation of the device at these or any other conditions
beyond those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect device reliability.
Military Operating Range
Operating Voltage
Military
3.3
+
0.3V
Operating Temperature
-55°C to + 125°C
Recommended DC Operating Conditions
Parameter
Vcc
GND
V
IL
V
IH
Note:
Description
Supply voltage
Ground
Input low voltage
Input high voltage
Min
3
0.0
GND - 0.3
2.2
Typ
3.3
0.0
0.0
–
Max
3.6
0.0
0.8
V
CC
+ 0.3
(1)
Unit
V
V
V
V
1. FT version: 5.5V in DC, 5.8V in transient conditions.
Capacitance
Parameter
C
in(1)
(OE and Ax)
C
in(1)
(CSx and
WEx)
C
io(1)
Note:
Description
Input capacitance
Input capacitance
I/O capacitance
Min
–
–
–
Typ
–
–
–
Max
48
12
12
Unit
pF
pF
pF
1. Guaranteed but not tested.
5
7531B–AERO–02/06