Telephone Circuit, CMOS, CDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
crystal frequency | 3.58 MHz |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -25 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2.5/10 V |
Certification status | Not Qualified |
Maximum slew rate | 16 mA |
surface mount | NO |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
AY-5-9559CERAMIC | AY-5-9559PLASTIC | |
---|---|---|
Description | Telephone Circuit, CMOS, CDIP16 | Telephone Circuit, CMOS, PDIP16 |
Is it Rohs certified? | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown |
crystal frequency | 3.58 MHz | 3.58 MHz |
JESD-30 code | R-XDIP-T16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 |
Number of terminals | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C |
Minimum operating temperature | -25 °C | -25 °C |
Package body material | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
power supply | 2.5/10 V | 2.5/10 V |
Certification status | Not Qualified | Not Qualified |
Maximum slew rate | 16 mA | 16 mA |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | OTHER | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Base Number Matches | 1 | 1 |