S2559GP datasheet, PDF - EEWORLD Datasheet

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S2559GP: DescriptionTelephone Circuit, CMOS, PDIP16,; CategoryWireless rf/communication Telecom circuit; File Size520KB，9 Pages; ManufacturerAMI Semiconductor

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S2559GP Overview

Telephone Circuit, CMOS, PDIP16,

S2559GP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	unknown
crystal frequency	3.58 MHz
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2.5/10 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

S2559GP Related Products

	S2559GP	S2559A-P	S2559HP	S2559D-P	S2559C-P	S2559HC	S2559HD	S2559B-P	S2559A-D	S2559B-C
Description	Telephone Circuit, CMOS, PDIP16,	Telephone Circuit, CMOS, PDIP16,	Telephone Circuit, CMOS, PDIP16,	Telephone Circuit, CMOS, PDIP16,	Telephone Circuit, CMOS, PDIP16,	Telephone Circuit, CMOS, CDIP16,	Telephone Circuit, CMOS, CDIP16,	Telephone Circuit, CMOS, PDIP16,	Telephone Circuit, CMOS, CDIP16,	Telephone Circuit, CMOS, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
crystal frequency	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz	3.58 MHz
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16	16	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V	2.5/10 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1	1

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