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Only One Name Means ProT
ek’Tion™
LC0408FC24C
LOW CAPACIT
ANCE FLIP CHIP ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
Personal Digital Assistant (PDA)
✔
Notebook Computers
✔
SMART Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Available in Six Voltage Types Ranging From 3.3V to 24V
✔
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Low Clamping Voltage
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 4 to 7 Lines
✔
LOW CAPACITANCE
✔
LOW LEAKAGE CURRENT
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0408
✔
Weight 0.73 milligrams (Approximate)
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
✔
Top Contacts: Solder Bump 0.004” in Height (Nominal)
0408
(Single Chip Shown)
PIN CONFIGURA
TION
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LC0408FC24C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
200
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
3.3
5.9
8.0
12.0
15.0
24.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
@8/20µs
V
C
@ I
PP
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
@0V, 1 MHz
C
pF
70
35
32
30
25
20
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
200W, 8/20µs Waveform
100
e
-t
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
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GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
225°C
5-10 sec
60
200°C
Instantaneous
to 200°C
100
80
% Of Rated Power
FIGURE 4
REFLOW SOLDER PROFILE
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
Pre-Heat
Time
Soldering
Time
Cool Down
Time
100°C
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
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15
20
V
C
- Clamping Voltage - Volts
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
A
B
C
E
SIDE
MILLIMETERS
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
2.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
INCHES
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.079 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
TOP
F
G
H
A
B
C
G
I
E
F
H
0.406 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
END
I
MOUNTING PAD LA
YOUT - Option 1
DIM
D
C
A
DIE
SOLDER
BUMP
PAD DIMENSIONS
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
A
C
D
E
F
G
H
I
NOTE:
E
H
G
1.
Preferred:
Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
F
Outline & Dimensions: Rev 4 - 2/04, 06021
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PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LA
YOUT - Option 2
PACKAGE DIMENSIONS
DIM
A
F
MILLIMETERS
0.51
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.006 SQ
0.028
0.039
0.020
COPPER CONTACT 0.009” [0.23] DIA.
A
DIE
SOLDER
BUMP
G
H
I
H
G
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Using 0.1mm (0.004”) stencil.
I
Outline & Dimensions: Rev 4 - 2/04, 06021
T
APE & REEL ORIENT TION
A
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
F
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0408FC05C-T75-1).
3.
8mm Paper Tape:
7 Inch Reels -5,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., LC0408FC05C-T710-2).
COPYRIGHT © ProTek Devices 2004
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
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