Consumer Circuit, CMOS, PDSO20, SOP-20
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | SOP-20 |
Contacts | 20 |
Reach Compliance Code | compliant |
Commercial integrated circuit types | CONSUMER CIRCUIT |
JESD-30 code | R-PDSO-G20 |
JESD-609 code | e3/e2 |
length | 12.5 mm |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.9 mm |
Maximum slew rate | 7 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN/TIN COPPER |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 10 |
width | 5.4 mm |
Base Number Matches | 1 |
BU1920F-E2 | BU1920FS-E2 | BU1920FS-E1 | BU1920F-E1 | |
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Description | Consumer Circuit, CMOS, PDSO20, SOP-20 | Consumer Circuit, CMOS, PDSO16, SSOP-16 | Consumer Circuit, CMOS, PDSO16, SSOP-16 | Consumer Circuit, CMOS, PDSO20, SOP-20 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to |
Parts packaging code | SOIC | SOIC | SOIC | SOIC |
package instruction | SOP-20 | SSOP-16 | SSOP-16 | SOP-20 |
Contacts | 20 | 16 | 16 | 20 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
Commercial integrated circuit types | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 code | R-PDSO-G20 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G20 |
JESD-609 code | e3/e2 | e3/e2 | e3/e2 | e3/e2 |
length | 12.5 mm | 6.6 mm | 6.6 mm | 12.5 mm |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 16 | 16 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | LSSOP | LSSOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.9 mm | 1.6 mm | 1.6 mm | 1.9 mm |
Maximum slew rate | 7 mA | 7 mA | 7 mA | 7 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 10 | 10 | 10 | 10 |
width | 5.4 mm | 4.4 mm | 4.4 mm | 5.4 mm |
Base Number Matches | 1 | 1 | 1 | - |