Flash Module, 1MX32, 120ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68 |
Reach Compliance Code | unknown |
Maximum access time | 120 ns |
startup block | BOTTOM |
Data polling | YES |
JESD-30 code | S-CQFP-G68 |
JESD-609 code | e0 |
length | 22.36 mm |
memory density | 33554432 bit |
Memory IC Type | FLASH MODULE |
memory width | 32 |
Number of functions | 1 |
Number of departments/size | 1,2,1,15 |
Number of terminals | 68 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX32 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFP |
Encapsulate equivalent code | QFP68,.99SQ,50 |
Package shape | SQUARE |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Programming voltage | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3.51 mm |
Department size | 4K,2K,8K,16K |
Maximum standby current | 0.0002 A |
Maximum slew rate | 0.14 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | NOR TYPE |
width | 22.36 mm |
Base Number Matches | 1 |