FIFO, 8KX9, 50ns, Asynchronous, CMOS, CDIP28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | TEMIC |
| Reach Compliance Code | unknown |
| Maximum access time | 50 ns |
| Maximum clock frequency (fCLK) | 15.38 MHz |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 73728 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8KX9 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.004 A |
| Maximum slew rate | 0.13 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
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