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UT54ACS139-UCX

Description
Decoder/Driver, CMOS, CDFP16,
Categorylogic    logic   
File Size307KB,8 Pages
ManufacturerAeroflex
Websitehttp://www.aeroflex.com/
Download Datasheet Parametric Compare View All

UT54ACS139-UCX Overview

Decoder/Driver, CMOS, CDFP16,

UT54ACS139-UCX Parametric

Parameter NameAttribute value
MakerAeroflex
package instructionDFP, FL16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDFP-F16
Logic integrated circuit typeOTHER DECODER/DRIVER
MaximumI(ol)0.0001 A
Number of functions2
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5 V
Prop。Delay @ Nom-Sup15 ns
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

UT54ACS139-UCX Related Products

UT54ACS139-UCX UT54ACS139-PCA UT54ACS139-UCC UT54ACTS139-UCX UT54ACTS139-UCA UT54ACTS139-PCA UT54ACS139-PCC
Description Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDIP16,
package instruction DFP, FL16,.3 DIP, DIP16,.3 DFP, FL16,.3 DFP, FL16,.3 DFP, FL16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
JESD-30 code R-XDFP-F16 R-XDIP-T16 R-XDFP-F16 R-XDFP-F16 R-XDFP-F16 R-XDIP-T16 R-XDIP-T16
Logic integrated circuit type OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
MaximumI(ol) 0.0001 A 0.0001 A 0.0001 A 0.008 A 0.008 A 0.008 A 0.0001 A
Number of functions 2 2 2 2 2 2 2
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DFP DIP DFP DFP DFP DIP DIP
Encapsulate equivalent code FL16,.3 DIP16,.3 FL16,.3 FL16,.3 FL16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE FLATPACK FLATPACK FLATPACK IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT THROUGH-HOLE FLAT FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker Aeroflex - Aeroflex Aeroflex Aeroflex Aeroflex Aeroflex
Prop。Delay @ Nom-Sup 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns -

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