Decoder/Driver, CMOS, CDIP16,
Parameter Name | Attribute value |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
Logic integrated circuit type | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.0001 A |
Number of functions | 2 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 15 ns |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
UT54ACS139-PCA | UT54ACS139-UCC | UT54ACS139-UCX | UT54ACTS139-UCX | UT54ACTS139-UCA | UT54ACTS139-PCA | UT54ACS139-PCC | |
---|---|---|---|---|---|---|---|
Description | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, CDFP16, | Decoder/Driver, CMOS, CDFP16, | Decoder/Driver, CMOS, CDFP16, | Decoder/Driver, CMOS, CDFP16, | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, CDIP16, |
package instruction | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
JESD-30 code | R-XDIP-T16 | R-XDFP-F16 | R-XDFP-F16 | R-XDFP-F16 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 |
Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.0001 A | 0.0001 A | 0.0001 A | 0.008 A | 0.008 A | 0.008 A | 0.0001 A |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DFP | DFP | DFP | DFP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | FL16,.3 | FL16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | FLATPACK | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | FLAT | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Prop。Delay @ Nom-Sup | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | - |
Maker | - | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex |