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UT54ACS139-PCA

Description
Decoder/Driver, CMOS, CDIP16,
Categorylogic    logic   
File Size307KB,8 Pages
ManufacturerAeroflex
Websitehttp://www.aeroflex.com/
Download Datasheet Parametric Compare View All

UT54ACS139-PCA Overview

Decoder/Driver, CMOS, CDIP16,

UT54ACS139-PCA Parametric

Parameter NameAttribute value
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
Logic integrated circuit typeOTHER DECODER/DRIVER
MaximumI(ol)0.0001 A
Number of functions2
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Sup15 ns
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

UT54ACS139-PCA Related Products

UT54ACS139-PCA UT54ACS139-UCC UT54ACS139-UCX UT54ACTS139-UCX UT54ACTS139-UCA UT54ACTS139-PCA UT54ACS139-PCC
Description Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDFP16, Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDIP16,
package instruction DIP, DIP16,.3 DFP, FL16,.3 DFP, FL16,.3 DFP, FL16,.3 DFP, FL16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
JESD-30 code R-XDIP-T16 R-XDFP-F16 R-XDFP-F16 R-XDFP-F16 R-XDFP-F16 R-XDIP-T16 R-XDIP-T16
Logic integrated circuit type OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
MaximumI(ol) 0.0001 A 0.0001 A 0.0001 A 0.008 A 0.008 A 0.008 A 0.0001 A
Number of functions 2 2 2 2 2 2 2
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DFP DFP DFP DFP DIP DIP
Encapsulate equivalent code DIP16,.3 FL16,.3 FL16,.3 FL16,.3 FL16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK FLATPACK FLATPACK FLATPACK IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE FLAT FLAT FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Prop。Delay @ Nom-Sup 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns -
Maker - Aeroflex Aeroflex Aeroflex Aeroflex Aeroflex Aeroflex
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