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NX8530NH334

Description
Laser Diode Module Emitter, 2500Mbps, Through Hole Mount, CERAMIC PACKAGE-9
CategoryWireless rf/communication    Optical fiber   
File Size119KB,10 Pages
ManufacturerNEC Electronics
Download Datasheet Parametric View All

NX8530NH334 Overview

Laser Diode Module Emitter, 2500Mbps, Through Hole Mount, CERAMIC PACKAGE-9

NX8530NH334 Parametric

Parameter NameAttribute value
package instructionCERAMIC PACKAGE-9
Reach Compliance Codeunknown
body width5.4 mm
body height18.5 mm
Body length or diameter5.8 mm
Built-in featuresPIN PHOTODIODE, TEC, THERMISTOR
data rate2500 Mbps
maximum descent time0.12 ns
Fiber optic equipment typesLASER DIODE MODULE EMITTER
Installation featuresTHROUGH HOLE MOUNT
Number of channels1
Nominal operating wavelength1533 nm
minimum return loss6 dB
Rise Time0.12 ns
Supply current100 mA
Maximum supply voltage2 V
Minimum supply voltage0.9 V
surface mountNO
Minimum threshold current20 mA
Transmission typeDIGITAL
Base Number Matches1
DATA SHEET
LASER DIODE
NX8530NH,NX8531NH
1 550 nm InGaAsP MQW-DFB LASER DIODE MODULE
2.5 Gb/s DIRECTLY MODULATION LIGHT SOURCE FOR DWDM APPLICATIONS
DESCRIPTION
The NX8530NH and NX8531NH are 1 550 nm Multiple Quantum Wells
(MQW) structured Distributed Feed-Back (DFB) laser diode module TOSA
integrated a mini-TEC, with InGaAs monitor PIN-PD in a ceramic package
designed for SFP transceivers and other types of modules with LC receptacle.
FEATURES
• Optical output power
P
AVG
= 0 dBm MIN. (NX8530NH)
P
AVG
= 4 dBm MIN. (NX8531NH)
• Available for DWDM C-band and L-band wavelengths based on
ITU-T recommendations
(100 GHz grid, please refer to the
ORDERING INFORMATION)
• Built-in mini thermo-electric cooler with low power consumption
• Miniature 18.5 mm package with LC receptacle
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PL10716EJ01V0DS (1st edition)
Date Published June 2008 NS
Printed in Japan
2008
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