Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC44,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | S-PQCC-J44 |
| JESD-609 code | e0 |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 16384 |
| ROM programmability | MROM |
| speed | 16 MHz |
| Maximum slew rate | 15.5 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| S83C51FB-4A44 | S87C51FB-AF40 | S87C51FB-4K44 | S87C51FB-BK44 | S83C51FB-BN40 | S87C51FB-5A44 | S83C51FB-4B44 | S87C51FB-5F40 | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 24MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | S-PQCC-J44 | R-XDIP-T40 | S-XQCC-J44 | S-XQCC-J44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-XDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 44 | 40 | 44 | 44 | 40 | 44 | 44 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | QCCJ | DIP | QCCJ | QCCJ | DIP | QCCJ | QFP | DIP |
| Encapsulate equivalent code | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 | DIP40,.6 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| rom(word) | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 |
| ROM programmability | MROM | UVPROM | UVPROM | UVPROM | MROM | UVPROM | MROM | UVPROM |
| speed | 16 MHz | 24 MHz | 16 MHz | 24 MHz | 24 MHz | 16 MHz | 16 MHz | 16 MHz |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.8 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL |
| Maximum slew rate | 15.5 mA | 44 mA | 32 mA | - | 22.7 mA | 32 mA | 15.5 mA | 32 mA |
| Maker | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
