Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, CDIP40,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP40,.6 |
Reach Compliance Code | unknown |
bit size | 8 |
CPU series | 8051 |
JESD-30 code | R-XDIP-T40 |
JESD-609 code | e0 |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 256 |
rom(word) | 16384 |
ROM programmability | UVPROM |
speed | 24 MHz |
Maximum slew rate | 44 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
S87C51FB-AF40 | S83C51FB-4A44 | S87C51FB-4K44 | S87C51FB-BK44 | S83C51FB-BN40 | S87C51FB-5A44 | S83C51FB-4B44 | S87C51FB-5F40 | |
---|---|---|---|---|---|---|---|---|
Description | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 24MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
JESD-30 code | R-XDIP-T40 | S-PQCC-J44 | S-XQCC-J44 | S-XQCC-J44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-XDIP-T40 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 40 | 44 | 44 | 44 | 40 | 44 | 44 | 40 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DIP | QCCJ | QCCJ | QCCJ | DIP | QCCJ | QFP | DIP |
Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 | DIP40,.6 |
Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
rom(word) | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 |
ROM programmability | UVPROM | MROM | UVPROM | UVPROM | MROM | UVPROM | MROM | UVPROM |
speed | 24 MHz | 16 MHz | 16 MHz | 24 MHz | 24 MHz | 16 MHz | 16 MHz | 16 MHz |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | YES | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.8 mm | 2.54 mm |
Terminal location | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
Maximum slew rate | 44 mA | 15.5 mA | 32 mA | - | 22.7 mA | 32 mA | 15.5 mA | 32 mA |