EEPROM, 2KX8, 350ns, Parallel, NMOS, PDIP24, PLASTIC, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
Maximum access time | 350 ns |
Other features | BYTE WRITE; OVER 100 YEARS DATA RETENTION |
command user interface | NO |
Data polling | NO |
Data retention time - minimum | 100 |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
length | 31.56 mm |
memory density | 16384 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.82 mm |
Maximum standby current | 0.04 A |
Maximum slew rate | 0.11 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | NMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
width | 15.24 mm |
Base Number Matches | 1 |