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AM26LS32CN

Description
Line Driver/Receiver, TTL, PDIP16,
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size101KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
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AM26LS32CN Overview

Line Driver/Receiver, TTL, PDIP16,

AM26LS32CN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Maximum output low current0.008 A
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum receive delay25 ns
Maximum slew rate70 mA
Nominal supply voltage5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1
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AM26LS32CN Related Products

AM26LS32CN AM26LS33CN AM26LS32MN AM26LS32IN AM26LS32CD AM26LS32ID AM26LS33ID
Description Line Driver/Receiver, TTL, PDIP16, Line Driver/Receiver, TTL, PDIP16, Line Driver/Receiver, TTL, PDIP16, Line Driver/Receiver, TTL, PDIP16, Line Driver/Receiver, TTL, PDSO16, Line Driver/Receiver, TTL, PDSO16, Line Driver/Receiver, TTL, PDSO16,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 SOP, SOP16,.25 SOP, SOP16,.25 SOP, SOP16,.25
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 70 °C 70 °C 125 °C 85 °C 70 °C 85 °C 85 °C
Minimum operating temperature - - -55 °C -40 °C - -40 °C -40 °C
Maximum output low current 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP SOP SOP SOP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.25 SOP16,.25 SOP16,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum receive delay 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns
Maximum slew rate 70 mA 70 mA 70 mA 70 mA 70 mA 70 mA 70 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO YES YES YES
technology TTL TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL MILITARY INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1

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