GD74HCT322J datasheet, PDF - EEWORLD Datasheet

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GD74HCT322J: DescriptionShift Register, 8-Bit, CMOS, CDIP20,; Categorylogic logic; File Size329KB，6 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HCT322J Overview

Shift Register, 8-Bit, CMOS, CDIP20,

GD74HCT322J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T20
JESD-609 code	e0
Maximum Frequency@Nom-Sup	12000000 Hz
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

GD74HCT322J Related Products

	GD74HCT322J	GD54HC322J	GD54HCT322J	GD74HC322J	GD74HCT322	GD74HC322D	GD74HCT322D	GD74HC322
Description	Shift Register, 8-Bit, CMOS, CDIP20,	Shift Register, 8-Bit, CMOS, CDIP20,	Shift Register, 8-Bit, CMOS, CDIP20,	Shift Register, 8-Bit, CMOS, CDIP20,	Shift Register, 8-Bit, CMOS, PDIP20,	Shift Register, 8-Bit, CMOS, PDSO20,	Shift Register, 8-Bit, CMOS, PDSO20,	Shift Register, 8-Bit, CMOS, PDIP20,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-PDIP-T20	R-PDSO-G20	R-PDSO-G20	R-PDIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Maximum Frequency@Nom-Sup	12000000 Hz	11000000 Hz	10000000 Hz	13000000 Hz	12000000 Hz	13000000 Hz	12000000 Hz	13000000 Hz
Number of digits	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20	20
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	SOP20,.4	SOP20,.4	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
power supply	5 V	2/6 V	5 V	2/6 V	5 V	2/6 V	5 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	-	-	-

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