UPD4481322GF-A75 datasheet, PDF

UPD4481322GF-A75: DescriptionZBT SRAM, 256KX32, 4.2ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100; Categorystorage storage; File Size221KB，28 Pages; ManufacturerNEC Electronics

Download Datasheet Parametric View All

UPD4481322GF-A75 Overview

ZBT SRAM, 256KX32, 4.2ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, LQFP-100

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	14 X 20 MM, PLASTIC, LQFP-100
Reach Compliance Code	compliant
Maximum access time	4.2 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	8388608 bit
Memory IC Type	ZBT SRAM
memory width	32
Number of functions	1
Number of terminals	100
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX32
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
Base Number Matches	1

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components