MC74HC154JDS datasheet, PDF - EEWORLD Datasheet

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MC74HC154JDS: DescriptionIC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC; Categorylogic logic; File Size316KB，5 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC74HC154JDS Overview

IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC

MC74HC154JDS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Logic integrated circuit type	OTHER DECODER/DRIVER
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MC74HC154JDS Related Products

	MC74HC154JDS	MC74HC154DWDS	MC74HC154J	MC74HC154JD	MC74HC154JS	MC74HC154NS	MC54HC154JDS	MC74HC154NDS
Description	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,SOP,24PIN,PLASTIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,PLASTIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC	IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP24,.3	SOP, SOP24,.4	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T24	R-PDSO-G24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-40 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	SOP24,.4	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
surface mount	NO	YES	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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