D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDIP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e4 |
| Logic integrated circuit type | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 125000000 Hz |
| MaximumI(ol) | 0.02 A |
| Number of functions | 4 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 31 mA |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
| N74F175AN | N74F175AD | N74F175D | |
|---|---|---|---|
| Description | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDIP16, | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDSO16, | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDSO16, |
| Is it Rohs certified? | conform to | conform to | incompatible |
| package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609 code | e4 | e4 | e0 |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 125000000 Hz | 125000000 Hz | 100000000 Hz |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A |
| Number of functions | 4 | 4 | 4 |
| Number of terminals | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | SOP16,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 31 mA | 31 mA | 34 mA |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES |
| technology | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD