74LVC32ABQ datasheet, PDF - EEWORLD Datasheet

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74LVC32ABQ: DescriptionIC LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, SOT-762-1, DHVQFN-14, Gate; Categorylogic logic; File Size115KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC32ABQ Overview

IC LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, SOT-762-1, DHVQFN-14, Gate

74LVC32ABQ Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFN
package instruction	HVQCCN, LCC14,.1X.12,20
Contacts	14
Reach Compliance Code	compliant
series	LVC/LCX/Z
JESD-30 code	R-PQCC-N14
JESD-609 code	e4
length	3 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	OR GATE
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC14,.1X.12,20
Package shape	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Sup	5 ns
propagation delay (tpd)	5.5 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.2 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	2.5 mm

74LVC32ABQ Related Products

	74LVC32ABQ	74LVC32APW
Description	IC LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, SOT-762-1, DHVQFN-14, Gate	IC LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14, Gate
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	NXP	NXP
Parts packaging code	QFN	TSSOP
package instruction	HVQCCN, LCC14,.1X.12,20	4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Contacts	14	14
Reach Compliance Code	compliant	unknown
series	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PQCC-N14	R-PDSO-G14
JESD-609 code	e4	e4
length	3 mm	5 mm
Load capacitance (CL)	50 pF	50 pF
Logic integrated circuit type	OR GATE	OR GATE
MaximumI(ol)	0.024 A	0.024 A
Humidity sensitivity level	1	1
Number of functions	4	4
Number of entries	2	2
Number of terminals	14	14
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	TSSOP
Encapsulate equivalent code	LCC14,.1X.12,20	TSSOP14,.25
Package shape	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260
power supply	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	5 ns	5 ns
propagation delay (tpd)	5.5 ns	5.5 ns
Certification status	Not Qualified	Not Qualified
Schmitt trigger	NO	NO
Maximum seat height	1 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.2 V	1.2 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD	GULL WING
Terminal pitch	0.5 mm	0.65 mm
Terminal location	QUAD	DUAL
Maximum time at peak reflow temperature	30	30
width	2.5 mm	4.4 mm

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