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82S131/BEA

Description
OTP ROM, 512X4, 70ns, TTL, CDIP16,
Categorystorage    storage   
File Size140KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

82S131/BEA Overview

OTP ROM, 512X4, 70ns, TTL, CDIP16,

82S131/BEA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
Maximum access time70 ns
JESD-30 codeR-XDIP-T16
JESD-609 codee0
memory density2048 bit
Memory IC TypeOTP ROM
memory width4
Number of terminals16
word count512 words
character code512
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512X4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

82S131/BEA Related Products

82S131/BEA 82S131/BFA 82S130/BFA 82S130/BEA
Description OTP ROM, 512X4, 70ns, TTL, CDIP16, OTP ROM, 512X4, 70ns, TTL, CDFP16, OTP ROM, 512X4, 70ns, TTL, CDFP16, OTP ROM, 512X4, 70ns, TTL, CDIP16,
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DFP, FL16,.3 DFP, FL16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 70 ns 70 ns 70 ns 70 ns
JESD-30 code R-XDIP-T16 R-XDFP-F16 R-XDFP-F16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0
memory density 2048 bit 2048 bit 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 4 4 4 4
Number of terminals 16 16 16 16
word count 512 words 512 words 512 words 512 words
character code 512 512 512 512
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 512X4 512X4 512X4 512X4
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DFP DFP DIP
Encapsulate equivalent code DIP16,.3 FL16,.3 FL16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK FLATPACK IN-LINE
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO YES YES NO
technology TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -

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