|
HEF4002BPN |
HEF4002BTD-T |
HEF4002BDF |
Description |
NOR Gate, CMOS, PDIP14, |
NOR Gate, CMOS, PDSO14, |
NOR Gate, CMOS, CDIP14, |
Is it Rohs certified? |
conform to |
conform to |
incompatible |
Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction |
DIP, DIP14,.3 |
SOP, SOP14,.25 |
DIP, DIP14,.3 |
Reach Compliance Code |
unknown |
unknown |
unknown |
JESD-30 code |
R-PDIP-T14 |
R-PDSO-G14 |
R-XDIP-T14 |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
NOR GATE |
NOR GATE |
NOR GATE |
MaximumI(ol) |
0.00036 A |
0.00036 A |
0.00036 A |
Number of terminals |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC |
encapsulated code |
DIP |
SOP |
DIP |
Encapsulate equivalent code |
DIP14,.3 |
SOP14,.25 |
DIP14,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
power supply |
5/15 V |
5/15 V |
5/15 V |
Prop。Delay @ Nom-Sup |
120 ns |
120 ns |
120 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
surface mount |
NO |
YES |
NO |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Base Number Matches |
1 |
1 |
1 |
JESD-609 code |
e4 |
- |
e0 |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Tin/Lead (Sn/Pb) |