VI Brick DC-DC converters use advanced Sine Amplitude Converter
TM
(SAC
TM
)
technology, thermally enhanced packaging technologies, and advanced CIM
processes to provide high power density and efficiency, superior transient
response, and improved thermal management. The high speed 3.5 MHz, zero
current switching–zero voltage switching (ZCS–ZVS) design enables efficient and
low noise operation throughout the operating range.
Communications
Distributed power
ATE
Defense
Aerospace
Medical
And other applications requiring
high efficiency
Product Selection: 36 – 75 V DC Input Range
Output Voltage
1.0 Vdc
1.5 Vdc
1.8 Vdc
2.5 Vdc
3.0 Vdc
3.3 Vdc
5 Vdc
10 Vdc
12 Vdc
15 vdc
24 Vdc
28 Vdc
48 Vdc
Output Power (W)
100
120
144
175
180
165
180
180
220
200
220
190
220
Current (A)
100
80
80
70
60
50
36
18
18.33
13.33
9.17
6.79
4.58
Efficiency (%)
85
87
89
90
91
91
91
92
92
92
92
92
93
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
DC048B
010
015
018
025
030
033
050
100
120
150
240
280
480
Part Numbering
010
012
014
017
018
016
018
018
022
020
022
019
022
Product Grade Temperatures (°C)
Grade
T
=
M
=
Operating
–40 to +100
–55 to +100
Storage
–40 to +125
–65 to +125
Baseplate
F
= Slotted flange
T
= Longitudinal heat sink
[a]
[a]
Contact
Pin Style
P
= Through hole
factory
VI Brick / 48V Input DC-DC Converter Modules
vicorpower.com
Rev. 1.0
Page 1 of 21
MODULE FAMILY ELECTRICAL CHARACTERISTICS
Electrical characteristics apply over the full operating range of input voltage, output load (resistive) and baseplate temperature,
unless otherwise specified. All temperatures refer to the operating temperature at the center of the baseplate.
Absolute Maximum Ratings
Parameter
+In to –In voltage
PC to –In voltage
+Out to -Out
1.0 V
1.5 V
1.8 V
2.5 V
3.0 V
3.3 V
5V
10 V
12 V
15 V
24 V
28 V
48 V
Isolation voltage
In to out
In to base
Out to base
Operating Temperature
Storage Temperature
Pin soldering temperature
Mounting torque
-0.5 to 4.0
-0.5 to 4.0
-0.5 to 4.0
-0.5 to 6.0
-0.5 to 6.0
-0.5 to 12.0
-0.5 to 12.0
-0.5 to 30.0
-0.5 to 30.0
-0.5 to 25
-0.5 to 50.0
-0.5 to 48.0
-0.5 to 60.0
2,250
2,250
707
-55 to +100
-65 to +125
500 (260)
750 (390)
5 (0.57)
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
°C
°C
°F (°C)
°F (°C)
in-lbs (N-m)
Test voltage
Test voltage
Test voltage
M-Grade
M-Grade
<5 sec; wave solder
<7 sec; hand solder
6 each
Rating
-1.0 to +85
-0.3 to +6.0
Unit
Vdc
Vdc
Notes
Note:
Stresses in excess of the maximum ratings can cause permanent damage to the device. Operation of the device is not implied at these or any other conditions
in excess of those given in the specification. Exposure to absolute maximum ratings can adversely affect device reliability.
Input Specifications
Parameter
Operating input voltage
Input surge withstand
Undervoltage turn-on
Undervoltage turn-off
Overvoltage turn-on
Overvoltage turn-off
Recommended external
input capacitance
30.4
75.7
33.8
31.8
77.3
78.8
100
81.0
Min
36
Typ
48
Max
75
85
35.3
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
µF
See Figure 19
Notes
VI Brick / 48V Input DC-DC Converter Modules
vicorpower.com
Rev. 1.0
Page 2 of 21
MODULE FAMILY ELECTRICAL CHARACTERISTICS (CONT.)
Output Specifications
Parameter
Output voltage setpoint
Line regulation
Temperature regulation
[a]
[a]
Min
Typ
2%
±0.5
±0.03
Max
±1
.05
Unit
Vout nom.
%
% / °C
Notes
Nominal input; full load; 25°C
Low line to high line; full load, deviation from setpoint
Over operating temperature range
For important information relative to applications where the converter modules are subject to continuous dynamic loading, contact Vicor applications engineering at 800-927-9474.
Control Specifications
Parameter
Primary Control (PC)
DC voltage
Module disable voltage
Module enable voltage
Disable hysteresis
Current limit
Disable delay time
4.8
2.3
5.0
2.4
2.5
100
1.75
1
1.90
2.6
5.2
Vdc
Vdc
Vdc
mV
mA
µs
Referenced to –In
Referenced to –In
Referenced to –In
Min
Typ
Max
Unit
Notes
Thermal Resistance and Capacity
Parameter
Baseplate to sink; flat, greased surface
Baseplate to sink; thermal pad
Baseplate to ambient
Baseplate to ambient; 1000 LFM
Thermal capacity
Min
Typ
0.20
0.18
6.5
2.0
47.7
Max
Unit
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Watt-sec/°C
8
Thermal Impedance (°C/W)
7
6
5
4
3
2
1
0
0
200
400
600
800
1000
Air Velocity (LFM)
Figure 1
– Thermal impedance vs. airflow
VI Brick / 48V Input DC-DC Converter Modules
vicorpower.com
Rev. 1.0
Page 3 of 21
MODULE FAMILY ELECTRICAL CHARACTERISTICS (CONT.)
General Specifications
Parameter
Isolation voltage
Isolation resistance (in to out)
Weight
Thermal protection
Agency approvals
125
Min
In to out
In to base
Out to base
Typ
2,250
2,250
707
10
2.19
62.14
130
cTÜVus, CE
135
Max
Unit
Vdc
Vdc
Vdc
megohms
ounces
grams
°C
Junction temperature, with automatic recovery
UL60950-1, CSA0950-1, EN60950-1, IEC60950-1.
With appropriate fuse in series with the +Input
Notes
Test voltage, complies with basic insulation requirements
Test voltage, complies with basic insulation requirements
Test voltage, complies with operational insulation requirements
Note:
Specifications are subject to change without notice.
VI Brick / 48V Input DC-DC Converter Modules
vicorpower.com
Rev. 1.0
Page 4 of 21
1.0 Vout, 100 W OPERATING SPECIFICATIONS - (e.g. DC048B010T010FP)
Parameter
Efficiency
Ripple and noise
Output OVP setpoint
Dissipation, standby
Load regulation
Output capacitance
Load current
Current limit (peak)
Short circuit current (avg)
Min
82
1.17
5.5
±0.6
0
108
0
Typ
85
100
Max
138
1.24
7.6
±1.5
108,000
100
130
50
Unit
%
mV
Volts
Watts
%
µF
Amps
Amps
Amps
Notes
Nominal input; full load; 25°C
p-p; Nominal input; full load; 20 MHz bandwith
25°C; recycle input voltage to restart (1 minute off)
No load
No load to full load; nominal input, deviation from setpoint
External
Shut down, may require PC enable to initiate restart
Shut down, may require PC enable to initiate restart
The progress of Xianji Ecosystem is really fast. Their products have many pins, and there are no relevant visual configuration tools for pin management and hardware canvas layout, which is quite troub...
There is a piece of board with an empty space on it, about 5CM*5CM. I happen to have a small board inside the 5CM*5CM area. I want to dig it out and make other small boards. How should I cut it in the...
1 IntroductionWith the increasing application of DSP in communication, control, test/measurement, electronic entertainment and other fields, DSP technology is developing faster and faster, and the sel...
1. Introduction to CPK-RA6M4 development board
This development board is designed based on Renesas R7FA6M4AF3CFB, and it has the following features:144-pin LQFP package200 MHz Arm Cortex-M33 core with...
[i=s]This post was last edited by Aguilera on 2020-3-12 21:55[/i]The multi-string RGB LED lighting design uses high-resolution dimming to achieve independent multi-string LED lighting, which is ideal ...
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
