|
S54LS266F/883C |
S54LS266W/883B |
Description |
XNOR Gate, TTL, CDIP14 |
XNOR Gate, TTL, CDFP14 |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction |
DIP, DIP14,.3 |
DFP, FL14,.3 |
Reach Compliance Code |
unknown |
unknown |
JESD-30 code |
R-XDIP-T14 |
R-XDFP-F14 |
JESD-609 code |
e0 |
e0 |
Logic integrated circuit type |
XNOR GATE |
XNOR GATE |
Number of terminals |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
Output characteristics |
OPEN-COLLECTOR |
OPEN-COLLECTOR |
Package body material |
CERAMIC |
CERAMIC |
encapsulated code |
DIP |
DFP |
Encapsulate equivalent code |
DIP14,.3 |
FL14,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
FLATPACK |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
Filter level |
MIL-STD-883 Class C |
MIL-STD-883 Class B (Modified) |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
NO |
YES |
technology |
TTL |
TTL |
Temperature level |
MILITARY |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
FLAT |
Terminal pitch |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Base Number Matches |
1 |
1 |