FIFO, 1KX9, 20ns, Asynchronous, CMOS, PQCC32,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | TEMIC |
Reach Compliance Code | unknown |
Maximum access time | 20 ns |
Maximum clock frequency (fCLK) | 33.33 MHz |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e0 |
memory density | 9216 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of terminals | 32 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX9 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 0.14 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Base Number Matches | 1 |