1G bits DDR2 SDRAM
| Parameter Name | Attribute value |
| Maker | ELPIDA |
| Parts packaging code | BGA |
| package instruction | TFBGA, |
| Contacts | 60 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| access mode | MULTI BANK PAGE BURST |
| Maximum access time | 0.45 ns |
| Other features | AUTO/SELF REFRESH |
| JESD-30 code | R-PBGA-B60 |
| length | 10.5 mm |
| memory density | 1073741824 bi |
| Memory IC Type | DDR DRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 60 |
| word count | 134217728 words |
| character code | 128000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 95 °C |
| Minimum operating temperature | |
| organize | 128MX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| self refresh | YES |
| Maximum supply voltage (Vsup) | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| width | 8 mm |
| EDE1108AFBG-6E-F | EDE1108AFBG-8E-F | EDE1108AFBG-8G-F | EDE1108AFBG | |
|---|---|---|---|---|
| Description | 1G bits DDR2 SDRAM | 1G bits DDR2 SDRAM | 1G bits DDR2 SDRAM | 1G bits DDR2 SDRAM |
| Maker | ELPIDA | ELPIDA | ELPIDA | - |
| Parts packaging code | BGA | BGA | BGA | - |
| package instruction | TFBGA, | TFBGA, | TFBGA, | - |
| Contacts | 60 | 60 | 60 | - |
| Reach Compliance Code | unknow | unknow | unknow | - |
| ECCN code | EAR99 | EAR99 | EAR99 | - |
| access mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | - |
| Maximum access time | 0.45 ns | 0.4 ns | 0.4 ns | - |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - |
| JESD-30 code | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B60 | - |
| length | 10.5 mm | 10.5 mm | 10.5 mm | - |
| memory density | 1073741824 bi | 1073741824 bi | 1073741824 bi | - |
| Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM | - |
| memory width | 8 | 8 | 8 | - |
| Number of functions | 1 | 1 | 1 | - |
| Number of ports | 1 | 1 | 1 | - |
| Number of terminals | 60 | 60 | 60 | - |
| word count | 134217728 words | 134217728 words | 134217728 words | - |
| character code | 128000000 | 128000000 | 128000000 | - |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| Maximum operating temperature | 95 °C | 95 °C | 95 °C | - |
| organize | 128MX8 | 128MX8 | 128MX8 | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | TFBGA | TFBGA | TFBGA | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | - |
| self refresh | YES | YES | YES | - |
| Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | - |
| Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | - |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | - |
| surface mount | YES | YES | YES | - |
| technology | CMOS | CMOS | CMOS | - |
| Temperature level | OTHER | OTHER | OTHER | - |
| Terminal form | BALL | BALL | BALL | - |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | - |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | - |
| width | 8 mm | 8 mm | 8 mm | - |
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