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GD74HC688J

Description
Magnitude Comparator, CMOS, CDIP20,
Categorylogic    logic   
File Size200KB,4 Pages
ManufacturerLG Semicon Co., Ltd.
Download Datasheet Parametric Compare View All

GD74HC688J Overview

Magnitude Comparator, CMOS, CDIP20,

GD74HC688J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP20,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T20
JESD-609 codee0
Logic integrated circuit typeMAGNITUDE COMPARATOR
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply2/6 V
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

GD74HC688J Related Products

GD74HC688J GD74HC688D GD74HCT688D GD54HC688J GD54HCT688J GD74HCT688J GD74HC688 GD74HCT688
Description Magnitude Comparator, CMOS, CDIP20, Magnitude Comparator, CMOS, PDSO20, Magnitude Comparator, CMOS, PDSO20, Magnitude Comparator, CMOS, CDIP20, Magnitude Comparator, CMOS, CDIP20, Magnitude Comparator, CMOS, CDIP20, Magnitude Comparator, CMOS, PDIP20, Magnitude Comparator, CMOS, PDIP20,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP20,.3 SOP, SOP20,.4 SOP, SOP20,.4 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T20 R-PDSO-G20 R-PDSO-G20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-PDIP-T20 R-PDIP-T20
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR
Number of terminals 20 20 20 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -55 °C -55 °C -40 °C -40 °C -40 °C
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 SOP20,.4 SOP20,.4 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 2/6 V 2/6 V 5 V 2/6 V 5 V 5 V 2/6 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO YES YES NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker - - LG Semicon Co., Ltd. - LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd.

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