5000mA, 80V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-276AB, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | TO-276AB |
package instruction | CHIP CARRIER, R-CBCC-N3 |
Contacts | 3 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Shell connection | COLLECTOR |
Maximum collector current (IC) | 5 A |
Collector-emitter maximum voltage | 80 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 70 |
JEDEC-95 code | TO-276AB |
JESD-30 code | R-CBCC-N3 |
Number of components | 1 |
Number of terminals | 3 |
Maximum operating temperature | 200 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Certification status | Not Qualified |
surface mount | YES |
Terminal form | NO LEAD |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Transistor component materials | SILICON |
Nominal transition frequency (fT) | 60 MHz |
Base Number Matches | 1 |
2N5154SMD-JQR-B | 2N5154SMD-JQR | 2N5154SMD-JQR-A | 2N5154SMDR4 | |
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Description | 5000mA, 80V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-276AB, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN | 5000mA, 80V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-276AB, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN | 5000mA, 80V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-276AB, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN | 5000mA, 80V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-276AB, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Lead free |
Is it Rohs certified? | incompatible | incompatible | incompatible | conform to |
Parts packaging code | TO-276AB | TO-276AB | TO-276AB | TO-276AB |
package instruction | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 |
Contacts | 3 | 3 | 3 | 3 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Shell connection | COLLECTOR | COLLECTOR | COLLECTOR | COLLECTOR |
Maximum collector current (IC) | 5 A | 5 A | 5 A | 5 A |
Collector-emitter maximum voltage | 80 V | 80 V | 80 V | 80 V |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE |
Minimum DC current gain (hFE) | 70 | 70 | 70 | 70 |
JEDEC-95 code | TO-276AB | TO-276AB | TO-276AB | TO-276AB |
JESD-30 code | R-CBCC-N3 | R-CBCC-N3 | R-CBCC-N3 | R-CBCC-N3 |
Number of components | 1 | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 | 3 |
Maximum operating temperature | 200 °C | 200 °C | 200 °C | 200 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | NPN | NPN | NPN | NPN |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES | YES |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Transistor component materials | SILICON | SILICON | SILICON | SILICON |
Nominal transition frequency (fT) | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
Base Number Matches | 1 | 1 | 1 | 1 |