EEWORLDEEWORLDEEWORLD

Part Number

Search

K0562-K60

Description
Multilayer Chip Capacitors
File Size138KB,17 Pages
ManufacturerETC
Download Datasheet View All

K0562-K60 Overview

Multilayer Chip Capacitors

Multilayer Chip Capacitors
X7R/B Characteristic
Features
q
q
q
q
High volumetric efficiency
Non-linear capacitance change
High insulation resistance
High pulse strength
l
b
s
k
k
KKE0272-V
Applications
q
q
q
q
Blocking
Coupling
Decoupling
Interference suppression
Dimensions
(mm)
Size
inch/mm
0402/1005
0603/1608
0805/2012
1206/3216
1210/3225
1812/4532
2220/5750
Terminations
q
For soldering:
l
1,0
±
0,10
1,6
±
0,15*)
2,0
±
0,20
3,2
±
0,20
3,2
±
0,30
4,5
±
0,30
5,7
±
0,40
b
0,50
±
0,05
0,80
±
0,10
1,25
±
0,15
1,60
±
0,15
2,50
±
0,30
3,20
±
0,30
5,00
±
0,40
s
0,5
±
0,05
0,8
±
0,10
1,3 max.
1,3 max.
1,7 max.
1,3 max.
1,3 max
k
0,2
0,3
0,5
0,5
0,5
0,5
0,5
Sizes 0402 through 1210:
silver/nickel/tin
Sizes 1812, 2220:
silver palladium
q
For conductive adhesion:
All sizes:
silver palladium
Packing
q
Blister and cardboard tape,
for details refer to chapter
“Taping and Packing”, page
111.
q
Bulk case for sizes 0603, 0805
and 1206, for details see page
114.
Maximum ratings
Climatic category
in accordance with IEC 68-1: 55/125/56
*) For bulk cases: 1,6
±
0,1
Tolerances in acc. with CECC 32101-801
Available capacitance tolerances
Tolerance
C
R
/C
R
=
±
5 %
C
R
/C
R
=
±
10 %
C
R
/C
R
=
±
20 %
Symbol
J
K
M
Standard tolerance in bold print
J tolerance not available for 16 V, 200 V and
500 V
Rated voltage values
V
R
= 16 V, 25 V, 50 V,100 V, 200 V, 500 V
Siemens Matsushita Components
27
FPGA Practice (I) Light up 8 LEDs
[i=s]This post was last edited by bqgup on 2019-4-12 19:20[/i] [postbg]3.jpg[/postbg][font=黑体][size=4] In most FPGA clocks, we will use the clock line. Since this is the first time to contact FPGA, le...
bqgup Innovation Lab
The first year of Wi-Fi 6 popularization has arrived. What chips and products are available?
Due to the impact of the epidemic, MWC2020 was cancelled, but new phones from major mobile phone manufacturers are still being released one after another. Xiaomi released its new flagship phone Xiaomi...
Aguilera RF/Wirelessly
Introducing several analog circuit design software
Analog circuit design softwareAnalog circuit Simulator T-Spice Pro SmartSpice EldoSchematic simulation/physical design environmentCOSMOS SE/LEDigital /analog mixed signal simulationHSPICE/NanoSimMixed...
fighting Analog electronics
The new DY-FFTB6638 MSP430 development kit
[i=s]This post was last edited by jiesuheshang on 2020-7-21 22:58[/i]Hello everyone, there are 2 sets of brand new DY-FFTB6638 development kits for sale, the price is 400 yuan/set. Contact: 1592972006...
jiesuheshang Buy&Sell
ad wiring rules
Which rule is this? The pad wiring is green...
dinghao1 PCB Design
Various commonly used integrated IC component package libraries, is there any need?
Various commonly used integrated IC component packaging libraries. If you need them, please leave your email address...
捷配pcb打样快 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号