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IRKC71/06A

Description
80 A, 600 V, SILICON, RECTIFIER DIODE
CategoryDiscrete semiconductor    diode   
File Size175KB,9 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Download Datasheet Parametric View All

IRKC71/06A Overview

80 A, 600 V, SILICON, RECTIFIER DIODE

IRKC71/06A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInternational Rectifier ( Infineon )
Parts packaging codeTO-240AA
package instructionR-XUFM-X3
Contacts3
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresUL RECOGNIZED
applicationHIGH VOLTAGE POWER
Shell connectionISOLATED
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.5 V
JEDEC-95 codeTO-240AA
JESD-30 codeR-XUFM-X3
JESD-609 codee0
Maximum non-repetitive peak forward current1870 A
Number of components2
Phase1
Number of terminals3
Maximum operating temperature150 °C
Maximum output current80 A
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage600 V
surface mountNO
Terminal surfaceTIN LEAD
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Bulletin I27140 rev. E 10/02
IRK.56, .71 SERIES
STANDARD DIODES
Features
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage
ADD-A-pak
TM
GEN V Power Modules
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al
2
0
3
DBC insulator
Heatsink grounded
60 A
80 A
Mechanical Description
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a
solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.
The electrical terminals are secured against axial pull-out:
they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR
modules.
Electrical Description
These modules are intended for general purpose high
voltage applications such as high voltage regulated power
supplies, lighting circuits, temperature and motor speed
control circuits, UPS and battery charger.
Major Ratings and Characteristics
Parameters
I
F(AV)
@ 100°C
I
F(RMS)
I
FSM
@ 50Hz
@ 60Hz
I
2
t @ 50Hz
@ 60Hz
I
2
√t
V
RRM
range
T
J
T
STG
IRK.56
60
94
1600
1680
12.89
11.76
128.9
IRK.71
80
126
1790
1870
15.90
14.53
159
Units
A
A
A
A
KA
2
s
KA
2
s
KA
2
√s
V
o
400 to 1600
- 40 to 150
- 40 to150
C
C
o
www.irf.com
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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