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1N5806D2B-JQRS.LVT2

Description
Rectifier Diode, 1 Element, 1A, 150V V(RRM), Silicon, HERMETIC SEALED, CERAMIC, DLCC2 VARIANT B, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size194KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

1N5806D2B-JQRS.LVT2 Overview

Rectifier Diode, 1 Element, 1A, 150V V(RRM), Silicon, HERMETIC SEALED, CERAMIC, DLCC2 VARIANT B, 2 PIN

1N5806D2B-JQRS.LVT2 Parametric

Parameter NameAttribute value
package instructionHERMETIC SEALED, CERAMIC, DLCC2 VARIANT B, 2 PIN
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH RELIABILITY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeR-CDSO-N2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Maximum output current1 A
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum repetitive peak reverse voltage150 V
Maximum reverse recovery time0.025 µs
surface mountYES
Terminal formNO LEAD
Terminal locationDUAL
Base Number Matches1
ULTRAFAST RECOVERY
RECTIFIER DIODE
1N5806D2A / 1N5806D2B
Hermetic Ceramic Package Designed as a Drop-
In Replacement for D-5A MELF Package
Designed For High Rel Applications
Screening Options Available
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VRRM
VRMS
Vdc
IO
IFSM
TJ
Tstg
Maximum Reverse Repetitive Peak Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Rectified Current Io
2
= TA +55°C
(1)
Derate above TA 55°C
Non Repetitive Forward Surge Current
(2)
Junction Temperature Range
Storage Temperature Range
150V
105V
150V
1.0A
8.33mA/°C
35A
-65 to +175°C
-65 to +175°C
T HERMAL PROPERTIES
Symbols
Parameters
R
θJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP =25°C
R
θJA(PCB)
Thermal Resistance, Junction To Ambient
(3)
Max. Units
34 °C/W
150 °C/W
Notes
Notes
(1) IO2 is rated at 1.0A @ TA = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
154°C/W.
(2) TA = 25°C @ IO=1.0A and VRWM for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.067” x 0.105”)‡, (1.7mm x 2.76mm) ‡, horizontal in still air.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing orders.
Semelab plc
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 8318
Issue 2
Page 1 of 4

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