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IS61NP25618-100B2 |
IS61NLP25618-100B2 |
Description |
ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, PLASTIC, BGA-119 |
ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, PLASTIC, BGA-119 |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Parts packaging code |
BGA |
BGA |
package instruction |
PLASTIC, BGA-119 |
PLASTIC, BGA-119 |
Contacts |
119 |
119 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
3A991.B.2.A |
3A991.B.2.A |
Maximum access time |
5 ns |
5 ns |
Other features |
PIPELINED ARCHITECTURE |
PIPELINED ARCHITECTURE |
Maximum clock frequency (fCLK) |
100 MHz |
100 MHz |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-PBGA-B119 |
R-PBGA-B119 |
JESD-609 code |
e0 |
e0 |
length |
22 mm |
22 mm |
memory density |
4718592 bit |
4718592 bit |
Memory IC Type |
ZBT SRAM |
ZBT SRAM |
memory width |
18 |
18 |
Number of functions |
1 |
1 |
Number of terminals |
119 |
119 |
word count |
262144 words |
262144 words |
character code |
256000 |
256000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
organize |
256KX18 |
256KX18 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
Encapsulate equivalent code |
BGA119,7X17,50 |
BGA119,7X17,50 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY |
GRID ARRAY |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
240 |
240 |
power supply |
3.3 V |
2.5,3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
2.41 mm |
2.41 mm |
Maximum standby current |
0.01 A |
0.01 A |
Minimum standby current |
3.14 V |
3.14 V |
Maximum slew rate |
0.3 mA |
0.3 mA |
Maximum supply voltage (Vsup) |
3.465 V |
3.465 V |
Minimum supply voltage (Vsup) |
3.135 V |
3.135 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
BALL |
BALL |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
30 |
30 |
width |
14 mm |
14 mm |