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IS61NP25618-100B2

Description
ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, PLASTIC, BGA-119
Categorystorage    storage   
File Size133KB,21 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS61NP25618-100B2 Overview

ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, PLASTIC, BGA-119

IS61NP25618-100B2 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionPLASTIC, BGA-119
Contacts119
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time5 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density4718592 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals119
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum seat height2.41 mm
Maximum standby current0.01 A
Minimum standby current3.14 V
Maximum slew rate0.3 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1

IS61NP25618-100B2 Related Products

IS61NP25618-100B2 IS61NLP25618-100B2
Description ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, PLASTIC, BGA-119 ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, PLASTIC, BGA-119
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Parts packaging code BGA BGA
package instruction PLASTIC, BGA-119 PLASTIC, BGA-119
Contacts 119 119
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A
Maximum access time 5 ns 5 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK) 100 MHz 100 MHz
I/O type COMMON COMMON
JESD-30 code R-PBGA-B119 R-PBGA-B119
JESD-609 code e0 e0
length 22 mm 22 mm
memory density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM
memory width 18 18
Number of functions 1 1
Number of terminals 119 119
word count 262144 words 262144 words
character code 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 256KX18 256KX18
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA119,7X17,50 BGA119,7X17,50
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240
power supply 3.3 V 2.5,3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 2.41 mm 2.41 mm
Maximum standby current 0.01 A 0.01 A
Minimum standby current 3.14 V 3.14 V
Maximum slew rate 0.3 mA 0.3 mA
Maximum supply voltage (Vsup) 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
width 14 mm 14 mm
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