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WSE128K16-73H1I

Description
Memory Circuit, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size635KB,15 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WSE128K16-73H1I Overview

Memory Circuit, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66

WSE128K16-73H1I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codePGA
package instructionPGA,
Contacts66
Reach Compliance Codeunknown
Other featuresALSO CONTAINS 128K X 16 BIT SRAM
JESD-30 codeS-CPGA-P66
JESD-609 codee4
length27.3 mm
memory density2097152 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX16
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height4.34 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width27.3 mm
Base Number Matches1
White Electronic Designs
128Kx16 SRAM/EEPROM MODULE
FEATURES
Access Times of 35ns (SRAM) and 150ns (EEPROM)
Access Times of 45ns (SRAM) and 120ns (EEPROM)
Access Times of 70ns (SRAM) and 300ns (EEPROM)
Packaging
• 66 pin, PGA Type, 1.075" square HIP, Hermetic
Ceramic HIP (H1) (Package 400)
• 68 lead, Hermetic CQFP (G2T), 22mm (0.880")
square (Package 509). Designed to
t JEDEC 68
lead 0.990" CQFJ footprint (FIGURE 2)
128Kx16 SRAM
128Kx16 EEPROM
Organized as 128Kx16 of SRAM and 128Kx16 of
EEPROM Memory with separate Data Buses
Both blocks of memory are User Configurable as
256Kx8
Low Power CMOS
WSE128K16-XXX
PRELIMINARY*
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight - 13 grams typical
EEPROM MEMORY FEATURES
Write Endurance 10,000 Cycles
Data Retention at 25°C, 10 Years
Low Power CMOS Operation
Automatic Page Write Operation
Page Write Cycle Time 10ms Max.
Data Polling for End of Write Detection
Hardware and Software Data Protection
TTL Compatible Inputs and Outputs
* This product is under development, is not qualified or characterized and is subject to
change without notice.
FIGURE 1 – WSE128K16-XH1X PIN
CONFIGURATION
Top View
1
SD
8
SD
9
SD
10
A
13
A
14
A
15
A
16
NC
SD
0
SD
1
SD
2
11
22
12
SWE
2
#
SCS
2
#
GND
SD
11
A
10
A
11
A
12
V
CC
SCS
1
#
NC
SD
3
33
23
SD
15
SD
14
SD
13
SD
12
OE#
NC
SWE#
1
SD
7
SD
6
SD
5
SD
4
ED
8
ED
9
ED
10
A
6
A
7
NC
A
8
A
9
ED
0
ED
1
ED
2
44
34
V
CC
ECS
2
#
EWE
2
#
ED
11
A
3
A
4
A
5
EWE
1
#
ECS
1
#
GND
ED
3
55
45
ED
15
ED
14
ED
13
ED
12
A
0
A
1
A
2
ED
7
ED
6
ED
5
ED
5
66
56
PIN DESCRIPTION
ED
0-15
SD
0-15
A
0-16
SWE#
1-2
SCS#
1-2
OE#
V
CC
GND
NC
EWE#
1-2
ECS#
1-2
EEPROM Data Inputs/Outputs
SRAM Data Inputs/Outputs
Address Inputs
SRAM Write Enable
SRAM Chip Selects
Output Enable
Power Supply
Ground
Not Connected
EEPROM Write Enable
EEPROM Chip Select
BLOCK DIAGRAM
SWE
1
# SCS
1
#
OE#
A
0-16
128K x 8
SRAM
128K x 8
SRAM
128K x 8
EEPROM
128K x 8
EEPROM
SWE
2
# SCS
2
#
EWE
1
# ECS
1
#
EWE
2
# ECS
2
#
8
8
8
8
SD
0 - 7
SD
8 - 1 5
ED
0 - 7
ED
8 - 1 5
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2005
Rev. 3
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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