Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 167 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 110 ns |
Other features | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
startup block | BOTTOM |
JESD-30 code | R-PBGA-B167 |
length | 14 mm |
memory density | 536870912 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 167 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 32MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
width | 10.5 mm |
Base Number Matches | 1 |