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K8C1115EBM-FE1D0

Description
Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167
Categorystorage    storage   
File Size2MB,68 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K8C1115EBM-FE1D0 Overview

Flash, 32MX16, 110ns, PBGA167, 10.50 X 14 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-167

K8C1115EBM-FE1D0 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionLFBGA,
Contacts167
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time110 ns
Other featuresBOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup blockBOTTOM
JESD-30 codeR-PBGA-B167
length14 mm
memory density536870912 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals167
word count33554432 words
character code32000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width10.5 mm
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