S71NS128NA0BFWSE0 datasheet, PDF

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S71NS128NA0BFWSE0: DescriptionMemory Circuit, Flash+PSRAM, CMOS, PBGA44; Categorystorage storage; File Size2MB，113 Pages; ManufacturerAMD; Websitehttp://www.amd.com; Environmental Compliance

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S71NS128NA0BFWSE0 Overview

Memory Circuit, Flash+PSRAM, CMOS, PBGA44

S71NS128NA0BFWSE0 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	AMD
package instruction	FBGA, BGA44,8X14,20
Reach Compliance Code	compliant
Maximum access time	80 ns
JESD-30 code	R-PBGA-B44
Memory IC Type	MEMORY CIRCUIT
Mixed memory types	FLASH+PSRAM
Number of terminals	44
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA44,8X14,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
power supply	1.8 V
Certification status	Not Qualified
Maximum standby current	0.00004 A
Maximum slew rate	0.0525 mA
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Base Number Matches	1

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S71NS128NA0/S71NS064NA0 Based MCPs

Stacked Multi-Chip Product (MCP) MirrorBit™ Flash Memory

and PSRAM 128 Mb (8M x 16-bit) and 64 Mb (4M x 16-Bit),

110 nm CMOS 1.8 Volt-only, Multiplexed, Simultaneous Read/

Write, Burst Mode Flash Memory with

16 Mb (1M x 16-Bit) PSRAM

Data Sheet

ADVANCE

INFORMATION

Notice to Readers:

This document states the current technical specifications

regarding the Spansion product(s) described herein. Each product described

herein may be designated as Advance Information, Preliminary, or Full

Production. See

Notice On Data Sheet Designations

for definitions.

Publication Number

S71NS128_064NA0_00

Revision

Amendment

Issue Date

April 6, 2005

This document contains information on a product under development at Spansion, LLC. The information is intended to help you evaluate this product. Do not design in

this product without contacting the factory. Spansion reserves the right to change or discontinue work on this proposed product without notice.

A d v a n c e

I n f o r m a t i o n

Notice On Data Sheet Designations

Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, in-

cluding development, qualification, initial production, and full production. In all cases, however,

readers are encouraged to verify that they have the latest information before finalizing their de-

sign. The following descriptions of Spansion data sheet designations are presented here to

highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion LLC is developing one or more spe-

cific products, but has not committed any design to production. Information presented in a

document with this designation is likely to change, and in some cases, development on the prod-

uct may discontinue. Spansion LLC therefore places the following conditions upon Advance

Information content:

“This document contains information on one or more products under development at Spansion LLC. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a

commitment to production has taken place. This designation covers several aspects of the prod-

uct life cycle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical

specifications presented in a Preliminary document should be expected while keeping these as-

pects of production under consideration. Spansion places the following conditions upon

Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance

Information, Preliminary, or Full Production). This type of document will distinguish these prod-

ucts and their designations wherever necessary, typically on the first page, the ordering

information page, and pages with the DC Characteristics table and the AC Erase and Program

table (in the table notes). The disclaimer on the first page refers the reader to the notice on this

page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal

changes may include those affecting the number of ordering part numbers available, such as the

addition or deletion of a speed option, temperature range, package type, or V

range. Changes

may also include those needed to clarify a description or to correct a typographical error or in-

correct specification. Spansion LLC applies the following conditions to documents in this

category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local AMD or Fujitsu

sales office.

S71NS128NA0/S71NS064NA0 Based MCPs

S71NS128_064NA0_00_A0 April 6, 2005

A d v a n c e

I n f o r m a t i o n

Contents

S71NS128NA0/S71NS064NA0 Based MCPs . . . . . . . . . . . . . . . . . . . . . . . . 1

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

MCP Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

S71NS128NA0, 44-ball Very-Thin FBGA (NLB044) Pinout, NS128N + 16 PSRAM................................................................9

S71NS064NA0, 44-ball Very-Thin FBGA (NLD044) Pinout, NS064N + 16 PSRAM........................................................... 10

Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Order Number .........................................................................................................................................................................................12

Physical Dimension — S71NS128NA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

NLB044, 44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 9.2 x 8 mm Package .......................................................13

Physical Dimension — S71NS064NA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

NLD044, 44-Ball Very Thin Fine-pitch Ball Grid Array (BGA) 7.7 x 6.2 mm....................................................................... 14

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Block Diagram of Simultaneous Operation Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

VersatileIO™ (V

) Control.................................................................................................................................................................24

Requirements for Asynchronous Read Operation (Non-Burst)..............................................................................................24

Requirements for Synchronous (Burst) Read Operation...........................................................................................................25

Continuous Burst .........................................................................................................................................................................25

8-, 16-, and 32-Word Linear Burst with Wrap Around ....................................................................................................27

8-, 16-, and 32-Word Linear Burst without Wrap Around .............................................................................................27

Programmable Wait State................................................................................................................................................................... 28

Configuration Register ......................................................................................................................................................................... 28

Handshaking Feature............................................................................................................................................................................. 28

Simultaneous Read/Write Operations with Zero Latency ....................................................................................................... 28

Writing Commands/Command Sequences.................................................................................................................................... 28

Accelerated Program and Erase Operations................................................................................................................................. 28

Write Buffer Programming Operation............................................................................................................................................ 29

Autoselect Mode.....................................................................................................................................................................................30

Advanced Sector Protection and Unprotection............................................................................................................................30

Sector Protection.....................................................................................................................................................................................31

Persistent Sector Protection ................................................................................................................................................................31

Persistent Protection Bit (PPB) ................................................................................................................................................32

Persistent Protection Bit Lock (PPB Lock Bit) in Persistent Sector Protection Mode ..........................................32

Dynamic Protection Bit (DYB) ................................................................................................................................................32

Persistent Sector Protection Mode Lock Bit..................................................................................................................................34

Password Sector Protection................................................................................................................................................................34

64-bit Password .......................................................................................................................................................................................34

Password Mode Lock Bit......................................................................................................................................................................34

Persistent Protection Bit Lock (PPB Lock Bit) in Password Sector Protection Mode......................................................35

Hardware Data Protection Mode......................................................................................................................................................35

Write Protect (WP#) .................................................................................................................................................................36

WP# Boot Sector Protection .............................................................................................................................................................36

Low VCC Write Inhibit ........................................................................................................................................................................36

S71NS128NA0/S71NS064NA0 Based MCPs

S71NS128_064NA0_00_A0 April 6, 2005

S29NSxxxN MirrorBit

Flash Family . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

A d v a n c e

I n f o r m a t i o n

Write Pulse “Glitch” Protection ........................................................................................................................................................36

Logical Inhibit............................................................................................................................................................................................36

Power-Up Write Inhibit .............................................................................................................................................................36

Lock Register............................................................................................................................................................................................36

Standby Mode .........................................................................................................................................................................................37

Automatic Sleep Mode ..........................................................................................................................................................................37

RESET#: Hardware Reset Input .........................................................................................................................................................37

Power-up and Power-down Sequencing .....................................................................................................................37

Output Disable Mode............................................................................................................................................................................37

SecSi™ (Secured Silicon) Sector SectorFlash Memory Region.................................................................................................37

Factory Locked: Factor SecSi Sector Programmed and Protected At the Factory .................................................38

Customer SecSi Sector ...............................................................................................................................................................38

Common Flash Memory Interface (CFI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Reading Array Data................................................................................................................................................................................52

Set Configuration Register Command Sequence..........................................................................................................................52

Read Configuration Register Command Sequence ......................................................................................................................52

Read Mode Setting .......................................................................................................................................................................53

Programmable Wait State Configuration .............................................................................................................................53

Programmable Wait State .........................................................................................................................................................53

Handshaking ...................................................................................................................................................................................54

Burst Length Configuration .......................................................................................................................................................54

Burst Wrap Around ....................................................................................................................................................................54

RDY Configuration ......................................................................................................................................................................54

RDY Polarity ..................................................................................................................................................................................55

Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Reset Command......................................................................................................................................................................................56

Autoselect Command Sequence ...................................................................................................................................................... 58

Enter SecSi™ Sector/Exit SecSi Sector Command Sequence.................................................................................................... 58

Unlock Bypass Command Sequence ......................................................................................................................................59

Program Command Sequence ............................................................................................................................................................59

Program Command Sequence ..................................................................................................................................................59

Program Command Sequence (Unlock Bypass Mode) .....................................................................................................59

Accelerated Program.............................................................................................................................................................................59

Write Buffer Programming Command Sequence ........................................................................................................................ 60

Chip Erase Command Sequence ........................................................................................................................................................62

Chip Erase Command Sequence .............................................................................................................................................62

Sector Erase Command Sequence.....................................................................................................................................................63

Sector Erase Command Sequence ..........................................................................................................................................63

Accelerated Sector Erase ......................................................................................................................................................... 64

Erase Suspend/Erase Resume Commands.......................................................................................................................................65

Program Suspend/Program Resume Commands ..........................................................................................................................65

Lock Register Command Set Definitions ....................................................................................................................................... 66

Password Protection Command Set Definitions.......................................................................................................................... 66

Non-Volatile Sector Protection Command Set Definitions ......................................................................................................67

Global Volatile Sector Protection Freeze Command Set.......................................................................................................... 69

Volatile Sector Protection Command Set...................................................................................................................................... 69

Write Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

DQ7: Data# Polling ................................................................................................................................................................................75

RDY: Ready .............................................................................................................................................................................................77

DQ6: Toggle Bit I....................................................................................................................................................................................77

DQ2: Toggle Bit II...................................................................................................................................................................................77

Reading Toggle Bits DQ6/DQ2 ..........................................................................................................................................................79

DQ5: Exceeded Timing Limits ............................................................................................................................................................79

DQ3: Sector Erase Start Timeout State Indicator....................................................................................................................... 80

April 6, 2005 S71NS128_064NA0_00_A0

S71NS128NA0/S71NS064NA0 Based MCPs

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