Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Electronic Designs Corporation |
package instruction | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
Reach Compliance Code | unknown |
Maximum access time | 100 ns |
Spare memory width | 32 |
startup block | BOTTOM |
JESD-30 code | R-PBGA-B159 |
length | 22 mm |
memory density | 134217728 bit |
Memory IC Type | FLASH MODULE |
memory width | 64 |
Number of functions | 1 |
Number of terminals | 159 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX64 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 2.2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
width | 13 mm |
Base Number Matches | 1 |
W72M64V-100BC | W72M64V-120BC | W72M64V-150BI | W72M64V-100BM | W72M64V-120BM | W72M64V-120BI | W72M64V-150BM | W72M64V-100BI | W72M64V-150BC | |
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Description | Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
Maker | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
package instruction | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 100 ns | 120 ns | 150 ns | 100 ns | 120 ns | 120 ns | 150 ns | 100 ns | 150 ns |
Spare memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
JESD-30 code | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 |
length | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
memory density | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
Memory IC Type | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
memory width | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 159 | 159 | 159 | 159 | 159 | 159 | 159 | 159 | 159 |
word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
character code | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 70 °C |
Minimum operating temperature | - | - | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | - |
organize | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Programming voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | COMMERCIAL |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
width | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
startup block | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
type | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |