MT18JSF25672PIY-1G1XX datasheet, PDF

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MT18JSF25672PIY-1G1XX: DescriptionDDR DRAM Module, 256MX72, CMOS, LEAD FREE, RDIMM-240; Categorystorage storage; File Size758KB，20 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT18JSF25672PIY-1G1XX Overview

DDR DRAM Module, 256MX72, CMOS, LEAD FREE, RDIMM-240

MT18JSF25672PIY-1G1XX Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
JESD-609 code	e4
memory density	19327352832 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Gold (Au)
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	30
Base Number Matches	1

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2GB (x72, ECC, SR) 240-Pin DDR3 SDRAM RDIMM

Features

DDR3 SDRAM RDIMM

MT18JSF25672P – 2GB

MT18JSZF25672P – 2GB

For component data sheets, refer to Micron’s Web site:

www.micron.com

Features

• DDR3 functionality and operations supported as per

the component data sheet

• 240-pin, registered dual in-line memory module

(RDIMM)

• Fast data transfer rates: PC3-10600, PC3-8500,

or PC3-6400

• 2GB (256 Meg x 72)

• V

= 1.5V ±0.075V

• V

DDSPD

= +3.0V to +3.6V

• Supports ECC error detection and correction

• Nominal and dynamic on-die termination (ODT) for

data and strobe signals

• Single rank

• On-board I

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

• 8 internal device banks

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Gold edge contacts

• Pb-free

• Fly-by topology

• Terminated control, command, and address bus

Figure 1:

240-Pin RDIMM (MO-269 R/C C)

PCB height: 30.0mm (1.18in)

Options

• Full module heat spreader

• Operating temperature

–

Commercial (0°C

≤

+70°C)

–

Industrial (–40°C

≤

+85°C)

• Package

–

240-pin DIMM

• Frequency/CAS latency

–

1.5ns @ CL = 8 (DDR3-1333)

–

1.5ns @ CL = 9 (DDR3-1333)

–

1.5ns @ CL = 10 (DDR3-1333)

–

1.87ns @ CL = 7 (DDR3-1066)

–

1.87ns @ CL = 8 (DDR3-1066)

–

2.5ns @ CL = 5 (DDR3-800)

–

2.5ns @ CL = 6 (DDR3-800)

Marking

None

-1G5

-1G4

-1G3

-1G1

-1G0

-80C

-80B

Notes: 1. Contact Micron for industrial temperature

module offerings.

2. Not recommended for new designs.

Table 1:

Speed

Grade

-1G5

-1G4

-1G3

-1G1

-1G0

-80C

-80B

Key Timing Parameters

Data Rate (MT/s)

Industry

Nomenclature

PC3-10600

PC3-8500

PC3-6400

CL = 10

1333

–

CL = 9

1333

–

CL = 8

1333

1066

–

CL = 7

1066

–

1066

–

CL = 6

800

CL = 5

800

–

800

–

RCD

(ns)

13.5

13.125

12.5

(ns)

13.5

13.125

12.5

(ns)

49.5

50.625

52.5

PDF: 09005aef8303ca34/Source: 09005aef8303ca7a

JSF18C256x72P.fm - Rev. A 4/08 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

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