HYM7V65801BTQG-10P datasheet, PDF

Datasheet> All Categories > storage> storage> HYM7V65801BTQG-10P

HYM7V65801BTQG-10P: DescriptionSynchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144; Categorystorage storage; File Size261KB，14 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

Download Datasheet Parametric Compare View All

HYM7V65801BTQG-10P Overview

Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144

HYM7V65801BTQG-10P Parametric

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	MODULE
package instruction	DIMM, DIMM144,32
Contacts	144
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N144
memory density	536870912 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	144
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM144,32
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
self refresh	YES
Maximum standby current	0.016 A
Maximum slew rate	1.44 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	DUAL
Base Number Matches	1

HYM7V65801BTQG-10P Related Products

	HYM7V65801BTQG-10P	HYM7V65801BTQG-8	HYM7V65801BTQG-10S	HYM7V65801BLTQG-8	HYM7V65801BLTQG-10P	HYM7V65801BLTQG-10S
Description	Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	MODULE	MODULE	MODULE	MODULE	MODULE	MODULE
package instruction	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32
Contacts	144	144	144	144	144	144
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	6 ns	6 ns	6 ns	6 ns	6 ns	6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz	125 MHz	100 MHz	125 MHz	100 MHz	100 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144
memory density	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	64	64	64	64	64	64
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	144	144	144	144	144	144
word count	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8MX64	8MX64	8MX64	8MX64	8MX64	8MX64
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096	4096	4096	4096
self refresh	YES	YES	YES	YES	YES	YES
Maximum standby current	0.016 A	0.016 A	0.016 A	0.016 A	0.016 A	0.016 A
Maximum slew rate	1.44 mA	1.6 mA	1.44 mA	1.6 mA	1.44 mA	1.44 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

Recommended Resources

Amplitude modulation and detection circuit

IX0308CE series internal circuit diagram

CW3524 inverter circuit diagram

Electronic fire regulator circuit diagram

electronically regulated amplifier

555 pyroelectric infrared sensing and light control delay power-saving socket circuit

IoT platform architecture design: There are a lot of posts discussing the Internet of Things online, but most of them introduce theories or hardware and communication-related issues, such as the Internet of Things module, the Internet...; Jacktang RF/Wirelessly

DSP hardware and software architecture issues: [size=3][color=#252525][font=宋体] DSP hardware, software and system design are called the three major parts of DSP. I think this part is quite useful. [/font][/color] [color=#252525][font=宋体]When talki...; fish001 DSP and ARM Processors

Tantalum is easy to break down: As shown in the figure, 12V uses 25V100E tantalum capacitors, which are prone to breakdown and have a failure rate of 7%...; hoveyhxb Power technology

Use MSP430G2LaunchPad emulator to emulate MSP430F5529: I don't like using CCS environment, but now I finally found a good way to use MSP430G2LaunchPad emulator to emulate MSP430F5529. Wiring method as shown in the figure...; 火辣西米秀 Microcontroller MCU

Freescale's new generation of 8-bit MCUs "three all-rounders": According to market research experts, the continued rapid development of the global consumer electronics industry will drive the demand for the microcontroller (MCU) market. In China, the expansion of...; fighting MCU

MakeCode driver for the magnetic field sensor LIS2MDL: Demo program : https://makecode.microbit.org/_X1qKJtVXWeJrExtensionURL : https://github.com/makecode-extensions/LIS2MDLThis content is originally created by dcexpert, a user of EEWORLD forum. If you w...; dcexpert MEMS sensors

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components