Standard SRAM, 16X4, TTL, CDIP16,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Humidity sensitivity level | 2A |
| Number of terminals | 16 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16X4 |
| Output characteristics | OPEN-COLLECTOR |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 250 |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 74LS89DC | 54LS89DM | 54LS89FM | 7489PC | 74LS89FC | 74LS89PC | 7489FC | |
|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 16X4, TTL, CDIP16, | Standard SRAM, 16X4, TTL, CDIP16, | Standard SRAM, 16X4, TTL, CDFP16, | Standard SRAM, 16X4, 60ns, TTL, PDIP16, | Standard SRAM, 16X4, TTL, CDFP16, | Standard SRAM, 16X4, TTL, PDIP16, | Standard SRAM, 16X4, 60ns, TTL, CDFP16, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| word count | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| character code | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| Output characteristics | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DFP | DIP | DFP | DIP | DFP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | YES | NO | YES | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | - |
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