DP8390N/B+ datasheet, PDF - EEWORLD Datasheet

DP8390N/B+: DescriptionIC,LAN NODE CONTROLLER,CMOS,DIP,48PIN; CategoryThe embedded processor and controller Microcontrollers and processors; File Size621KB，56 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DP8390N/B+ Overview

IC,LAN NODE CONTROLLER,CMOS,DIP,48PIN

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP48,.6
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T48
JESD-609 code	e0
Number of terminals	48
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP48,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches	1

	DP8390N/B+	DP8390D/B+	DP8390CN-1
Description	IC,LAN NODE CONTROLLER,CMOS,DIP,48PIN	IC,LAN NODE CONTROLLER,CMOS,DIP,48PIN	IC,LAN NODE CONTROLLER,CMOS,DIP,48PIN
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-PDIP-T48	R-XDIP-T48	R-PDIP-T48
JESD-609 code	e0	e0	e0
Number of terminals	48	48	48
Maximum operating temperature	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP48,.6	DIP48,.6	DIP48,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, LAN	SERIAL IO/COMMUNICATION CONTROLLER, LAN	SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches	1	1	1
Maker	Texas Instruments	-	Texas Instruments

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