Chip Low Leakage Schottky Barrier Rectifier
KLFM120 THRU KLFM140
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 1
DS-12164S
Chip Low Leakage Schottky Barrier Rectifier
KLFM120 THRU KLFM140
1.0A Surface Mount Low Leakage
Schottky Barrier Rectifiers - 20V - 40V
Package outline
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Extra low reverse leakage current
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen free parts, ex. KLFM120-H.
Formosa MS
SMA
0.196(4.9)
0.180(4.5)
0.012(0.3) Typ.
0.106(2.7)
0.091(2.3)
Mechanical data
•
Epoxy:UL94-V0 rated flame retardant
•
Case : Molded plastic, DO-214AC / SMA
•
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.032(0.8) Typ.
0.068(1.7)
0.060(1.5)
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.05 gram
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Forward rectified current
Forward surge current
Reverse current
Diode capacitance
Storage temperature
See Fig.1
CONDITIONS
T
A
=25
o
C unless otherwise noted)
Symbol
I
O
I
FSM
I
R
C
J
T
STG
-65
MIN.
TYP.
MAX.
1.0
30
50
32
+175
UNIT
A
A
µA
pF
O
8.3ms single half sine-wave (JEDEC methode)
V
R
= V
RRM,
T
J
= 25
O
C
f=1MHz and applied 10V DC reverse voltage
C
SYMBOLS
KLFM120
KLFM130
KLFM140
*1
V
RRM
(V)
20
30
40
V
RMS
*2
(V)
14
21
28
*3
V
R
(V)
20
30
40
*4
V
F
(V)
Operating
temperature
T
J
, (
O
C)
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage @I
R
=100μA
0.50
-55 to +125
*4 Maximum forward voltage@I
F
=1.0A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 2
DS-12164S
Rating and characteristic curves (KLFM120 THRU KLFM140)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
1.2
1.0
50
INSTANTANEOUS FORWARD CURRENT,(A)
0.8
0.6
0.4
0.2
0
0
20
40
60
80
100
120
140
160
180
200
10
3.0
1.0
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
LEAD TEMPERATURE,(°C)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT,(A)
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
0.1
.01
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
FIG.5 - TYPICAL REVERSE
100
NUMBER OF CYCLES AT 60Hz
CHARACTERISTICS
10
FIG.4-TYPICAL DIODE CAPACITANCE
REVERSE LEAKAGE CURRENT, (mA)
150
1.0
125
f=1MHz
DIDOE CAPACITANCE, (pF)
0.1
100
75
0.01
T
J
=25°C
50
0.001
25
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
0
0
.5
10
15
20
25
30
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 3
DS-12164S
Chip Low Leakage Schottky Barrier Rectifier
KLFM120 THRU KLFM140
Pinning information
Pin
Pin1
Pin2
cathode
anode
Simplified outline
Formosa MS
Symbol
1
2
1
2
Marking
Type number
KLFM120
KLFM130
KLFM140
Marking code
K12
K13
K14
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SMA
A
0.110 (2.80)
B
0.063 (1.60)
C
0.087 (2.20)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 4
DS-12164S
Chip Low Leakage Schottky Barrier Rectifier
KLFM120 THRU KLFM140
Packing information
P
0
P
1
d
E
F
B
W
Formosa MS
A
P
D
2
T
C
D
W
1
D
1
unit:mm
Item
Symbol
Tolerance
SMA
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.80
5.00
1.90
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 5
DS-12164S