Fast Page DRAM Module, 1MX36, 70ns, CMOS, PSMA72
Parameter Name | Attribute value |
Maker | SK Hynix |
Parts packaging code | SIMM |
package instruction | SIMM, SSIM72 |
Contacts | 72 |
Reach Compliance Code | compliant |
Maximum access time | 70 ns |
I/O type | COMMON |
JESD-30 code | R-PSMA-N72 |
memory density | 37748736 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 36 |
Number of terminals | 72 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SIMM |
Encapsulate equivalent code | SSIM72 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 25.4 mm |
Maximum standby current | 0.012 A |
Maximum slew rate | 1.12 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | SINGLE |
Base Number Matches | 1 |
GMM7361000BS-70 | GMM7361000BS-60 | GMM7361000BS-80 | |
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Description | Fast Page DRAM Module, 1MX36, 70ns, CMOS, PSMA72 | Fast Page DRAM Module, 1MX36, 60ns, CMOS, PSMA72 | Fast Page DRAM Module, 1MX36, 80ns, CMOS, PSMA72 |
Maker | SK Hynix | SK Hynix | SK Hynix |
Parts packaging code | SIMM | SIMM | SIMM |
package instruction | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
Contacts | 72 | 72 | 72 |
Reach Compliance Code | compliant | compliant | compliant |
Maximum access time | 70 ns | 60 ns | 80 ns |
I/O type | COMMON | COMMON | COMMON |
JESD-30 code | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
memory density | 37748736 bit | 37748736 bit | 37748736 bit |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 36 | 36 | 36 |
Number of terminals | 72 | 72 | 72 |
word count | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 1MX36 | 1MX36 | 1MX36 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SIMM | SIMM | SIMM |
Encapsulate equivalent code | SSIM72 | SSIM72 | SSIM72 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 |
Maximum seat height | 25.4 mm | 25.4 mm | 25.4 mm |
Maximum standby current | 0.012 A | 0.012 A | 0.012 A |
Maximum slew rate | 1.12 mA | 1.24 mA | 1 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | SINGLE | SINGLE | SINGLE |
Base Number Matches | 1 | 1 | - |