PC755BMGS350LE datasheet, PDF - EEWORLD Datasheet

PC755BMGS350LE: DescriptionRISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，55 Pages; ManufacturerAtmel (Microchip)

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PC755BMGS350LE Overview

RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	CGA
package instruction	CGA,
Contacts	360
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-X360
length	25 mm
low power mode	YES
Number of terminals	360
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	CGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
speed	350 MHz
Maximum supply voltage	2.1 V
Minimum supply voltage	1.8 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	UNSPECIFIED
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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